Movable/replaceable high intensity target and multiple accelerator systems and methods

ABSTRACT

Presented systems and methods facilitate efficient and effective generation and delivery of radiation. In one embodiment, an accelerator system includes a particle source, an acceleration portion, a high intensity target, and a target location control component. The particle source is configured to generate charged particles. The acceleration portion is configured to accelerate the charged particles. The high intensity target is configured to generate Bremsstrahlung radiation in response to impact by the charged particles. The target location control component configured to change the location of charged particle impacts on the high intensity target. In one exemplary implementation the change of location of charged particle impact is based on thermal diffusion and said location of charged particle impacts is moved at a rate greater than a rate of diffusion of detrimental heat impacts on the high intensity target.

FIELD OF THE INVENTION

The present invention relates to the field of radiation beam generationand control. In one embodiment, systems and methods facilitate fast andeffective application of radiation therapy.

BACKGROUND

Radiation beams can be utilized in a number of different applicationsand accurately applying an appropriate amount of radiation can be veryimportant. Radiation beam therapy typically includes directing aradiation beam at an area of tissue. There can be various differenttypes of radiation beams (e.g., photon, ionizing particle, etc.). Theradiation beams are typically used to stop the growth or spread of thetargeted tissue cells by killing them or degrading their cell divisionability. While radiation therapy is generally considered beneficial,there can be a number of potential side effects. The side effects caninclude unintended damage to DNA of healthy tissue cells. Theeffectiveness of radiation therapy is primarily a function of the doseor amount of ionizing radiation that is applied to cancerous cells whileavoiding impacts to healthy cells.

The amount of radiation that is applied to the tissue is typically afunction of a dose rate and time the targeted tissue is exposed to theradiation. In some implementations, the dose rate corresponds to the“current” of charged particles used to generate the radiation. Thecharged particle (e.g., proton, electron, etc.) can be directed at thetissue or can be directed at an intermediate target (e.g., Xray target,etc.) that produces another fundamental or elementary particle (e.g.,photons, neutrons, etc.,) which are directed at the tissue. Theelementary particles can have radiation characteristics (e.g., X-raywavelength, ionizing capabilities, etc.). Higher dose rates usuallyenable shorter exposure times and that can have a number of benefits,including less opportunity for extraneous events to influence thetherapy, increased productivity, and greater convenience to the patient.

Various treatment approaches have characteristics that can offersignificant benefits. It was recently discovered that delivering atherapeutic dose at ultra high dose rates (>40 Gy/s), referred to asFLASH dose rate delivery, reduces the radiation sensitivity of healthytissue, but not of tumors. Delivering the same dose, but at ultra-highdose rates can increase the therapeutic ratio over conventionaltreatment delivery. Proton and electron radiation approaches can providehigher dose rates. Some conventional approaches have attempted toovercome traditional dose limitations by increasing the dose ratethrough higher MeV values. To be effective in some scenarios (e.g.,treating human tissue, etc.) electron and proton radiation approachesrequire very high beam energies in excess of 100 MeV and thereforerequire large and expensive systems. However, conventional Xray targetsystems are typically limited in their ability to participate in/performwith various treatment approaches that offer significant benefits, forexample, FLASH dose delivery. Conventional photon radiation approachestypically have a number of practical issues and obstacles thatsignificantly limit and prevent them from being useful in higher doseapplications (e.g., human medical applications, etc.). Developingsystems and methods compatible with higher MeV values can be difficultand problematic for conventional Xray target approaches.

One considerable conventional obstacle to higher dose rates in photonradiation approaches is avoiding problematic conditions (e.g.,overheating, thermal cycle stresses, cycle fatigue, etc.). Heat loadingcapabilities of traditional Xray targets (e.g., used in incidentelectron beam deceleration, used in production of Bremsstrahlungradiation, etc.) do not typically provide adequate heat removal at highpower densities (e.g., power into the target, etc.) and the targetsbegin to lose performance characteristics. Heating impacts can beparticularly detrimental in pulse and cycle-based radiation systemapplications. Xray targets typically experience expansion stressesassociated with increased heat when a pulse/cycle is in an on/high stageand contraction stresses associated with decreased heat when thepulse/cycle is in an off/low stage. The repeated expansion/contractionand internal stresses/strains can result in structural fatigue andfailure. For long-lifetime stationary targets, the acceptable power fora target is often limited by this cyclical fatigue rather than bymelting temperatures of target materials or thermal shock (e.g., lowcycle failure, instant failure, etc.). Because conventional targetscannot typically handle the power required to obtain FLASH dose rates,traditional FLASH delivery has mainly focused on using protons orelectrons.

Traditional FLASH delivery also mainly focused on using protons orelectrons because FLASH therapy appears to require a threshold dosebefore the FLASH effect materializes and also requires that the entiredose is delivered within a very small time window. In conventional stateof the art treatment plans, such as in arc therapy or intensitymodulated radiation therapy, the therapeutic dose is delivered to thetumor from many different angles and therefore most healthy tissue neverreaches the threshold dose at which FLASH dose rates would bebeneficial. For FLASH treatments to improve on state-of-the art deliveryit therefore also would need to deliver dose from multiple angles and itwould have to do that near-simultaneously. Conventional proton andelectron systems are typically too expensive to implement multipleaccelerators supplying simultaneous beams from multiple angels.Conventional gantry approaches are also usually too slow moving betweendelivery angles to satisfy the FLASH timings limitations.

If traditional limitations on target power handling capability anddelivery from different angles can be overcome, then X-ray FLASH offersseveral advantages over electron or ion FLASH.

SUMMARY

Presented systems and methods facilitate efficient and effectivegeneration and delivery of radiation. In one embodiment, an acceleratorsystem includes a particle source, an acceleration portion, a highintensity target, and a target location control component. The particlesource is configured to generate charged particles. The accelerationportion is configured to accelerate the charged particles. The highintensity target is configured to generate Bremsstrahlung radiation inresponse to impact by the charged particles. The target location controlcomponent configured to change the location of charged particle impactson the high intensity target. In one exemplary implementation the changeof location of charged particle impact is based on thermal diffusion andsaid location of charged particle impacts is moved at a rate greaterthan a rate of diffusion of detrimental heat impacts on the highintensity target.

In one embodiment, the high intensity target is a replaceable highintensity target and is replaced in accordance with catastrophic failuremechanism limitations rather than fatigue failure mechanism limitations.The Bremsstrahlung radiation can correspond to average dose ratesgreater than or equal to 1.0 greys per second (Gy/s) when measured atone meter from the radiation source. A power limit on the generation ofthe Bremsstrahlung radiation can be based upon a melting temperature ofa material which constitutes at least a portion of the high intensitytarget. The high intensity target can be configured to load in andunload from the accelerator system. In one embodiment, the targetlocation control component can move the high intensity target to adjusta location of charged particle impacts on the high intensity target. Theaccelerator can be calibrated with a source to axis distance (SAD) ofless than or equal to 80 cm. The accelerator can be one of a pluralityof accelerators. The accelerator can contribute Bremsstrahlung radiationcorresponding to average dose rates greater than or equal to 1.5 greysper second (Gy/s) at isocenter to a total dose rate of Bremsstrahlungradiation from said plurality of accelerators, wherein said total doserate of Bremsstrahlung radiation corresponds to average dose ratesgreater than or equal to 40.0 greys per second (Gy/s) at isocenter.

In one embodiment, a radiation method includes loading a replaceablehigh intensity target in a radiation system; producing Bremsstrahlungradiation with the replaceable high intensity target; and unloading thereplaceable high intensity target in a radiation system, wherein theunloading is associated with periodic replacement based uponcatastrophic failure mechanisms rather than protracted fatigue failuremechanisms. The periodic replacement of the removable high intensitytarget can correspond to a predetermined schedule. The loading of thereplaceable high intensity target and unloading of the replaceable highintensity target are performed automatically. The replaceable highintensity target can be disposed of after removal. In one embodiment,the method also includes providing information regarding the replaceablehigh intensity target to a target monitoring system. The method caninclude coordinating the generating Bremsstrahlung radiation from aplurality of accelerators. The method can include performing a qualitycheck on the replaceable high intensity target. In one exemplaryimplementation, the producing Bremsstrahlung radiation andloading/unloading the replaceable high intensity target is performed inaccordance with a treatment plan.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings together with the description are incorporatedin and form a part of this specification. They illustrate exemplaryembodiments and explain exemplary principles of the disclosure. They arenot intended to limit the present invention to the particularembodiments illustrated therein. The drawings are not to scale unlessotherwise specifically indicated.

FIG. 1 is a block diagram of an exemplary radiation therapy system inaccordance with an embodiment.

FIG. 2A is a block diagram of an exemplary accelerator system inaccordance with one embodiment.

FIG. 2B is another block diagram of an exemplary accelerator system inaccordance with one embodiment.

FIG. 2C is another block diagram of an exemplary accelerator system inaccordance with one embodiment.

FIG. 3A is a block diagram of exemplary multiple pulses per cycle inaccordance with one embodiment.

FIG. 3B is an exemplary graph indicating temperature of a high intensitytarget over time when being impacted by particles in accordance with oneembodiment.

FIG. 3C is a graphical representation of an example of a failurelimitation curve illustrated in terms of electron beam impacts vscorresponding strains in accordance with one embodiment.

FIG. 4 is a block diagram of particle beam impact locations on a highintensity target surface in accordance with one embodiment.

FIG. 5 is a block diagram of an exemplary adjustment of a particleimpact location on a high intensity target in accordance with oneembodiment.

FIG. 6 is a block diagram of exemplary configurations of high intensitytargets in accordance with one embodiment.

FIG. 7 is a block diagram of a high intensity target in accordance withone embodiment.

FIG. 8 is block diagram of high intensity target configurations inaccordance with one embodiment.

FIG. 9 is a block diagram of exemplary high intensity target inaccordance with one embodiment.

FIG. 10 is a block diagram illustrating the movement of a replaceablehigh intensity target in accordance with one embodiment.

FIG. 11 is a block diagram of exemplary particle impact adjustmentmotions or patterns in accordance with one embodiment.

FIG. 12 is a graphical representation example for a thermal profile of anon-moving conventional Xray target.

FIG. 13 is a graphical representation of an example maximum plasticstrain map for a moving target in accordance with one embodiment.

FIG. 14 is a graphical representation of an example maximum temperaturefor a moving target in accordance with one embodiment.

FIG. 15 is block diagram of a high intensity target system in accordancewith one embodiment.

FIG. 16 is a block diagram of an exemplary target movement system in afirst configuration and second configuration in accordance with oneembodiment.

FIG. 17 is a block diagram of an exemplary rack and pion movement systemin accordance with one embodiment.

FIG. 18 is a flow chart of an example high intensity target method inaccordance with one embodiment.

FIG. 19 is a block diagram of an exemplary holding system in accordancewith one embodiment.

FIG. 20 is a block diagram of an exemplary holding system in accordancewith one embodiment.

FIG. 21 is a block diagram of an exemplary holding system in accordancewith one embodiment.

FIG. 22A is a block diagram of an exemplary holding system in accordancewith one embodiment.

FIG. 22B is a block diagram of an exemplary holding system in accordancewith one embodiment.

FIG. 23 is block diagram of an exemplary multiple access system inaccordance with one embodiment.

FIG. 24 is block diagram of an exemplary traditional system inaccordance with one embodiment.

FIG. 25 is a block diagram of an exemplary accelerator enclosure accesssystem in accordance with one embodiment.

FIG. 26A includes a block diagram of an exemplary door typeconfiguration access/holding system and method in accordance with oneembodiment.

FIG. 26B includes a block diagram of another exemplary door typeconfiguration access/holding system and method in accordance with oneembodiment.

FIG. 27A is a block diagram of an exemplary latching component inaccordance with one embodiment

FIG. 27B is a block diagram of an exemplary latching component inaccordance with one embodiment.

FIG. 28 is a block diagram of an exemplary latching component inaccordance with one embodiment.

FIG. 29 is a block diagram of an exemplary latching component inaccordance with one embodiment.

FIG. 30 is a block diagram of a loading system tool system in accordancewith an embodiment.

FIG. 31 is a block diagram of an exemplary target injection/ejectionsystem in accordance with one embodiment.

FIG. 32 is a block diagram of an exemplary loading system in accordancewith an embodiment.

FIG. 33 is a block diagram of an exemplary loading system in accordancewith an embodiment.

FIG. 34 is block diagram of access component sealing systems inaccordance with one embodiment.

FIG. 35 is a block diagram of an exemplary multiple access radiationsystem in accordance with one embodiment.

FIG. 36 is a block diagram of exemplary magazine/cartridge loadingsystems in accordance with an embodiment.

FIG. 37 is a block diagram of high intensity target system in accordancewith one embodiment.

FIG. 38 is a block diagram of an exemplary accelerator system inaccordance with one embodiment.

FIG. 39 is a block diagram of an exemplary high intensity targetinteraction with a collimator in accordance with one embodiment.

FIG. 40 is a block diagram of an exemplary multiple cartridge system inaccordance with one embodiment.

FIG. 41 is a block diagram of another exemplary multiple cartridgesystem in accordance with one embodiment.

FIG. 42 is a flow chart of a high intensity target loading/unloadingmethod/process in accordance with one embodiment.

FIG. 43 shows an example of five accelerator systems in accordance withone embodiment.

FIG. 44(A) illustrates an exemplary configuration with five acceleratorsystems and 3 integrated kV imaging systems in accordance with oneembodiment.

FIG. 44(B) shows an exemplary configuration with seven acceleratorsystems, in which the kV imaging system is moved onto a separate ring tomake space for additional accelerator systems.

FIG. 44(C) shows an example of nine accelerator systems in a firstorientation in accordance with one embodiment.

FIG. 44(D) shows an example of nine accelerator systems in a secondorientation in accordance with one embodiment.

FIG. 45 is a block diagram of a high intensity target acceleratorrobotic arm system in accordance with one embodiment.

FIG. 46 is a block diagram of an example implementation with multipleaccelerator systems mounted on multiple robotic arms in accordance withone embodiment.

FIG. 47 is a graphical representation of some exemplary various aspects(e.g., configurations, functionalities, operations, conditions,features, characteristics, etc.) that are significantly different in thenew high intensity target systems and methods.

FIG. 48 is a block diagram of an exemplary radiation system withmultiple accelerators in accordance with one embodiment.

FIG. 49 is a block diagram of an exemplary multiple patient stationradiation system in accordance with one embodiment.

FIG. 50 is a block diagram of an exemplary remote resource system inaccordance with one embodiment.

DETAILED DESCRIPTION OF THE INVENTION

Reference will now be made in detail to the illustrated, exemplaryembodiments in the accompanying drawings. While the invention will bedescribed in conjunction with the exemplary embodiments, it will beunderstood that they are not intended to limit the invention to theseembodiments. On the contrary, the invention is intended to coveralternatives, modifications and equivalents, which may be includedwithin the spirit and scope of the invention as defined by the appendedclaims. Furthermore, in the following detailed description of thepresent invention, numerous specific details are set forth in order toprovide a thorough understanding of the present invention. However, itwill be obvious to one ordinarily skilled in the art that the presentinvention may be practiced without these specific details. In otherinstances, well known methods, procedures, components, and circuits havenot been described in detail as not to unnecessarily obscure aspects ofthe current invention.

Presented systems and methods facilitate efficient and effectiveradiation generation and control. High intensity target systems andmethods are capable of operating with high energy beams. In oneembodiment, high intensity target systems and methods produceBremsstrahlung generated radiation capable of delivering more than thetraditional photon system dose rate of less than 1 Gy/s. In oneexemplary implementation, high intensity target systems and methodsproduce Bremsstrahlung generated radiation capable of delivering FLASHdose rates (e.g., greater than or equal to 40 Gy/s, etc.).

It is appreciated that high intensity target systems and methods includevarious features/configurations that enable delivery of dose ratesgreater than or equal to 1 Gy/s, and overcome issues and limitations ofconventional approaches. The features/configurations can include movabletarget characteristics, replaceable target characteristics, adjustablesource axis distance SAD, and coordinated utilization of multipleaccelerators. While explanation of the various configurations/featuresmay appear to be presented individually in the following detaileddescription, it is appreciated that a system and method can include oneor a combination of more than one of these characteristics and features.

A high intensity target can be configured to be compatible withchanges/movement of charged particle impact locations on the highintensity target. In one embodiment, a high intensity target is moveable(e.g., within an accelerator, etc.) causing the charged particle impactlocation to move/change. In one exemplary implementation, movement ofthe charged particle impact location is based on thermal diffusion andis moved at a rate greater than diffusion of detrimental heat impacts onthe high intensity target. In one embodiment, detrimental heat impactsare ones that rise to a level of unacceptably interfering with reliableradiation generation and delivery. In one exemplary implementation, heatimpacts can cause localized damage in a high intensity target, but highintensity target system and method features and characteristics (e.g.,moveable target, replaceable target, etc.) can mitigate or prevent theheat impacts and localized damage from reaching a detrimental level thatadversely affects radiation delivery. Additional explanation of chargedparticle impact locations and high intensity target movement ispresented in other portions of this detailed description.

A high intensity target can be configured to be removable. In oneembodiment, a high intensity target is easily loaded to and unloadedfrom an accelerator system. In one embodiment, a high intensity targetcan be configured for use with a loading system/mechanism thatloads/unloads a high intensity target. In one exemplary implementation,a cartridge/magazine with a plurality of high intensity targets can beloaded to and unloaded from an accelerator system. Additionalexplanation of removable high intensity targets is presented in otherportions of this detailed description.

High intensity target systems and methods can be compatible with sourceaxis distance (SAD) adjustments. Additional explanation of SADadjustments is presented in other portions of this detailed description.

In one embodiment, multiple accelerator systems are utilized to deliverdoses from different orientations or angles. The delivery can besimultaneous or substantially at the same time. In one embodiment,simultaneously or substantially simultaneous means multiple thingsexisting or occurring in less than or equal to one second of oneanother. In one embodiment simultaneously or substantially simultaneousmeans less than or equal to one milli-second. The multiple acceleratorsystems can be implemented in various configurations. The number ofaccelerator systems and differences in radiation beam application anglescan vary. In one embodiment, a microwave generation system can powermultiple independent accelerator systems. In one exemplaryimplementation, a microwave generation system can power a plurality ofindependent accelerator systems via a plurality of independent RFchains, in which separate ones of the plurality of independentaccelerator systems are powered by a separate respective one of aplurality of separate RF systems included (e.g., bunched together, etc.)in the microwave generation system. Additional explanation of multipleaccelerator systems is presented in other portions of this detaileddescription.

High Intensity Target Accelerator Systems and Methods

FIG. 1 is a block diagram of an exemplary radiation therapy system 100in accordance with an embodiment. Radiation therapy system 100 includesan accelerator system 110, radiation beam control component 114 (e.g.,collimator, bend magnet, etc.), control system 120, and support device105. In one exemplary implementation, the accelerator system 110generates particles (e.g., photons, etc.) that have radiationcharacteristics. In one embodiment, elementary particles travel insubstantially the same direction and are included in a radiation beam.In one exemplary implementation, the radiation beam includes X-rays. Thesystem is compatible with a variety of accelerator systems (e.g., acontinuous wave beam accelerator, bevatron, an isochronous cyclotron, apulsed accelerator, a synchrocyclotron, a synchrotron, etc.). In oneembodiment, accelerator system 110 is considered a linear accelerator(LINAC) configuration. In one exemplary implementation, the acceleratorsystem 110 is capable of relatively continuous wave output and extractsparticles with a specified energy. In one exemplary implementation, theaccelerator is pulsed.

Accelerator system 110 includes particle source 111, accelerationportion 115, high intensity target 117, and target location controlcomponent 119. Particle source 111 can generate a particle beam (e.g.,electron beam, etc.). In one embodiment, particle source 111 iscompatible with particle acceleration using electromagnetic waves in themicrowave frequency range. The acceleration portion 115 allows particles(e.g., electrons, protons, photons, etc.) emitted by the particle source111 to travel to the high intensity target 117. The acceleration portion115 can accelerate the particles. It is appreciated the accelerationportion can have various configurations (e.g., drift tube, accelerationchannel, waveguide, etc.) In one exemplary implementation, theacceleration portion can also control the direction of the particles.The accelerator system 110 can include various other components (e.g.,dipole magnets, bending magnets, solenoid magnets, steering magnets,etc.) that direct (e.g., bend, steer, guide, etc.) resulting radiationbeam or x-rays through the system in a direction toward and through theradiation control component 114. The accelerator system 110 may alsoinclude components that are used to adjust the beam energy.

In one embodiment, the particle source 111 generates a beam of electronparticles that are accelerated by acceleration portion 115 towards highintensity target 117. When the electron particles collide with highintensity target 117 a secondary photon Bremsstrahlung radiation beam iscreated. In one exemplary implementation, the high intensity targetgenerates radiation in the form of X-rays. High intensity target 117 canreceive high energy input (e.g., greater than 1 MeV, etc.) and generatea relatively high quantity of radiation while maintaining overall systemintegrity and radiation delivery performance (e.g., including handlingstressful heat conditions, etc.). In one embodiment, a high intensitytarget can experience localized damage while other aspects of systemintegrity and radiation delivery performance are maintained. Additionaldescription of high intensity target systems and methods ability tomaintain reliable performance and accurate radiation delivery at highenergy input levels is presented in later portions of thisspecification.

In one embodiment, radiation control component 114 includes componentsthat control a radiation beam shape. In one exemplary implementation,radiation control component 114 can include a multi-leaf collimator(MLC) in which each MLC leaf can be independently adjusted (e.g., movedback-and-forth, etc.) to shape an aperture through which a beam canpass. The adjustments can be directed by control system 120. Theaperture can block or not block portions of the radiation beam andthereby control beam shape and exposure time. The beam can be considereda relatively well-defined beam. The radiation control component 114 canbe used to aim the beam toward various locations within an object (e.g.,a patient, target tissue, etc.). In one embodiment, the radiationcontrol component 114 controls a radiation beam in “X and Y directions”to scan a target tissue volume.

A target intended to receive the radiation (e.g., an object, a targettissue volume in a patient, etc.) can be located on the supportingdevice 105 (e.g., a chair, couch, bench, table, etc.) in a treatmentroom. In one embodiment, the accelerator system and the supportingdevice can be moved with respect to one another. The accelerator systemand supporting device can have various configurations (e.g., fixed,movable arm, movable gantry, etc.).

In one embodiment, control system 120 receives and directs execution ofa prescribed treatment plan. In one exemplary implementation, thecontrol system 120 includes a computer system having a processor,memory, and user interface components (e.g., a keyboard, a mouse, adisplay, etc.). The control system 120 can control parameters andoperations of the accelerator system 110 and supporting device 105,including parameters such as the energy, intensity, direction, size,shape of the beam, and so on. The control system 120 can receive dataregarding operation of the system 100 and control the componentsaccording to data it receives. The data can be included in theprescribed treatment plan. In one embodiment, the control system 120receives information and analyzes the performance and treatment beingprovided by radiation therapy system 100. In one embodiment, the controlsystem 120 can direct adjustments to the radiation therapy system 100based upon the analysis of dose and dose rate.

FIG. 2A is a block diagram of an exemplary accelerator system 200A inaccordance with one embodiment. In one exemplary implementation,accelerator system 200A produces Bremsstrahlung radiation. Acceleratorsystem 200A includes, particle source 211, accelerator portion 215, andhigh intensity target 217. Particle source 211, accelerator portion 215,and high intensity target 217 are similar to particle source 111,accelerator portion 115, and high intensity target 117. Particle source211 generates charged particles (e.g., 221, 222, 223, 224, 225, etc.)that are accelerated by accelerator portion 215 towards high intensitytarget 217 when high intensity target 217 is in an operational locationin an accelerator system. Additional explanation of an operationallocation is presented in other portions of this detailed description.High intensity target 217 includes particles (e.g., 231, 232, 233, 234,235, etc.). The charged particles (e.g., 223, 224, 225, etc.) impact orcollide with particles (e.g., 231, 233, 235, etc.) in the high intensitytarget 217. The impact/collision causes a deceleration or braking of thecharged particles resulting in a loss of kinetic energy. In accordancewith conservation of energy principles in physics, the resulting loss ofkinetic energy is converted into a release of energy in the form ofelectromagnetic radiation (e.g., photons, etc.) and heat. The heat cancause temperatures in portions of the high intensity target to increase.The resulting radiation can be considered Bremsstrahlung radiation.

In one embodiment, an operational location is one in which highintensity target 217 can be impacted by electrons and resultingBremsstrahlung radiation is released. An operational location can beconfigured to facilitate the release of the radiation in an intendedmanner while preventing release in an unintended manner. In oneembodiment, an operational location is enclosed in manner that allows aradiation beam to exit in an intended manner while preventing release inan unintended manner. In one exemplary implementation, a high intensitytarget can be moved to different positions within an operationallocation so that an electron beam impacts different locations on asurface of the high intensity target. Additional explanation ofoperational locations, movement of a high intensity target to differentpositions within an operational location, operational locations withinenclosures, and intended/unintended radiation release from anoperational location is presented in other portions of this detaileddescription.

FIG. 2B is another block diagram of an exemplary accelerator system 200Bin accordance with one embodiment. In one embodiment, accelerator system200B is similar to accelerator system 200A in a different configuration.FIG. 2B shows additional features of accelerator system 200B that enablehigh intensity target 217 to be placed in an operational location withinan accelerator system. FIG. 2B shows additional features of acceleratorsystem 200B including accelerator enclosure 205, target holdingsystem/component 250 and access system/component 270. In one embodiment,accelerator system 200B particle source 211 and acceleration portion 215are included in vacuum/acceleration chamber 210. Target holdingsystem/component 250 is configured to hold high intensity target 217 inan operational location within the accelerator enclosure 205. In oneembodiment, holding system/component 250 also moves high intensitytarget 217 to various positions within the operational location so thatan electron beam impacts different locations on a surface of the highintensity target 217. Access system/component 270 is configured toprovide access to an operational location (e.g., within accelerationenclosure 205, etc.). Additional discussion on high intensity targetloading and unloading is presented in other portions of this detaildescription section.

In one embodiment, accelerator enclosure 205 serves as a generalenclosure for accelerator system 200B. In one exemplary implementation,accelerator enclosure 205 can be considered a treatment head enclosure.In one embodiment, an operational position for a high intensity targetis located in the accelerator enclosure 205. In one exemplaryimplementation, accelerator enclosure 205, access system/component 270,and target holding system/component 250 can cooperatively operate toallow a radiation beam to exit in an intended manner (e.g., a radiationbeam in direction 291, etc.) while preventing release in an unintendedmanner (e.g., in direction 292, etc.). In one embodiment,vacuum/acceleration chamber includes window 281 that allows electronbeam 280 to pass through towards high intensity target 217 andaccelerator enclosure 205 includes an opening 282 that allows radiationbeam 291 to pass through (e.g., towards tissue target, tumor, etc.).Accelerator enclosure 205 can also act as a radiation shield againstradiation transmission/leaking in other directions (e.g., direction 292,etc.). It is appreciated accelerator system 200B can include othercomponents not shown in FIG. 2B. In one embodiment, accelerator system200B can include a collimator (e.g., similar to collimator 2355 in FIG.39 , etc.) that acts as both a holding component and collimator thatallows radiation to pass through the opening in the holdingcomponent/collimator while preventing radiation leaks in otherdirections.

FIG. 2C is another block diagram of an exemplary accelerator system 200Caccordance with one embodiment. In one embodiment, accelerator system200C is similar to accelerator system 200A in a different configuration.FIG. 2C shows additional features of accelerator system 200C that enablehigh intensity target 217 to be placed in an operational location. FIG.2C shows different features of accelerator system 200C including targetholding system/component 251 and access portal 271. In one exemplaryimplementation, target holding system/component 251 can allow aradiation beam to exit in an intended manner (e.g., a radiation beamexit through opening 282 in direction 291, etc.) while preventingrelease in an unintended manner (e.g., in direction 293, etc.). In oneexemplary implementation, target holding system/component 251 can act asboth a holding component and collimator (e.g., similar to collimator2355, etc.).

It is appreciated that an accelerator system can have variousconfigurations. In one embodiment, a target can be inserted/ejected toand from an operational location in an acceleration/vacuum chamber(e.g., similar to acceleration chamber 210, etc.). In one exemplary,implementation, a target can be inserted/ejected to and from anoperational location considered outside an accelerator enclosure. In oneexemplary implementation, an operational location can be considered anopen-air location.

It is appreciated a high intensity target approach is compatible withvarious forms of radiation generation (e.g., characteristic radiationgeneration, reflection radiation generation, etc.). The radiationemissions can include X-rays. The radiation can include elementaryparticles (e.g., photons, ions, electrons, etc.) and radiation emissionscan be configured in a beam. In one embodiment, electron beam energy isdelivered to a high intensity target in power cycles of multiple pulses.FIG. 3A is a block diagram of exemplary multiple pulses per cycle inaccordance with one embodiment. In one exemplary implementation, a pulse(e.g., 307 etc.) occurs when power is turned on and off multiple timesper second (e.g., pluses 301, 302, 305, etc.). In one embodiment, pulsesare delivered in cycles (e.g., 308, 309, etc.). A cycle can beconsidered to have an on phase and an off phase. In one embodiment, anon phase occurs when the power is delivered in multiple pulses (e.g.,pluses 301, 302, 305, etc.) per second (e.g., second 303, etc.). In oneembodiment, an off phase occurs when no pulses are delivered for atleast one second (e.g., second 304, etc.). In one exemplaryimplementation, a power cycle starts when an electron beam hits a highintensity target and ends after the electron beam has been off for atleast one second.

The operating parameter values and conditions for high intensity targetsystems and methods (e.g., high temperature, high strain, easy targetreplacement, etc.) can be different than conventional systems. Theoperating parameter values and conditions for high intensity targetsystems and methods (e.g., high temperature, high strain, easy targetreplacement, etc.) can provide high dose rates, unlike traditionalsystems in which the operating parameters and conditions (e.g., lowtemperature, low strain, very difficult target removal, etc.) as apractical matter typically prevent higher dose rates (e.g., greater than1 Gy/s, etc.). In one embodiment, a high intensity target system andmethod is configured to be operable with a high energy input electronbeam (e.g., greater than 1 MeV, 25 MeV, etc.) and high dose rates. Inone exemplary implementation, the higher power operation associated witha high intensity target can enable delivery of average dose ratesgreater than 1.0 gray per second (Gy/s) and peak dose rates greater than0.002 Grays per pulse (Gy/pulse). In one embodiment, the Bremsstrahlungradiation corresponds to average dose rates greater than or equal to1.5_greys per second (Gy/s) at isocenter.

In one embodiment, if the high intensity target is adjusted/moved at aspeed of 3-5 m/s then different/sequential pulses hit a different beamimpact location that has no/negligible temperature increase due todissipated heat associated with another pulse. In one exemplaryimplementation, there is room for a temperature increase by a factor of2.

In one embodiment, when generating radiation (e.g., x-rays, etc.) fromelectron beams via Bremsstrahlung mechanisms, most of the electron beamenergy delivered to the high intensity target is converted to heat. Theconversion to heat can result in high intensity target temperaturechanges. In one exemplary implementation, a thermal cycle corresponds torises and falls in temperature as power/energy delivery to a highintensity target is turned on and off in electron beam pulses andcycles. The changes in temperature can lead to detrimental impacts andpotentially result in damage to a target. The characteristics of thetemperature rise and fall (e.g., how much, how fast, how often, etc.)can determine the amount and type of damage. In one embodiment,efficiently and effectively dealing with potential damage to a targetincludes addressing failure limitations. The failure limitations can beassociated with a point at which a loss of reliable radiation deliveryoccurs. In one embodiment, a failure includes a permanent change to atarget that renders it unable to create/deliver radiation withclinically required properties. In one exemplary implementation, atarget fails when it is unable to deliver the radiation propertiesappropriate for a treatment plan. Failure limitations can be associatedwith different failure mechanisms.

As indicated above, there are several characteristics of temperaturechanges (e.g., how much the temperature value changes/rises, how manytimes/cycles the temperature changes, the rate at which the temperaturechanges, etc.) due to particle beam impacts that can result inproblems/failures in a target. Higher electron beam energy levels canproduce higher temperature rises. High temperature rises/values thatreach melting point levels can cause a high intensity target to melt.The number of thermal cycles or rises and falls in temperature causesstresses/strains that can result in target failure. A large number ofcycles with low temperature changes can cause failure. Also, a smallnumber of cycles with high temperature changes can cause failure. Inaddition to potential problems associated with the value a temperaturerise reaches (e.g., such as melting, etc.), how fast the rise occurs canpotentially have other detrimental impacts. Higher electron beam energylevels applied over a short period of time can produce highertemperature rises in a short period of time. A significant amount oftemperature change at a rapid rate can cause transient mechanical loads(e.g., stresses, strains, etc.) that result in target failure (e.g., canexceed the ultimate tensile strength of the target, etc.). The differentfailure mechanisms and limitations can involve exposing a high intensitytarget to a relatively few cycles (e.g., over a short duration, etc.)versus exposing a traditional target to relatively many cycles (e.g.,over a long duration, etc.). Again, it is appreciated that differentfailure mechanisms and failure limitations can be associated withdifferent characteristics of a temperature rise and fall.

A failure mechanism that involves a rapid and significant change in highintensity target temperature can be referred to as a catastrophicfailure mechanism. In one exemplary implementation, a catastrophicfailure occurs within one/few thermal cycles (e.g., associated with afew electron beam impact energy cycles, etc.). In one exemplaryimplementation, a catastrophic failure mechanism can be based upondifferent factors (e.g., ultimate tensile strength, fracture strain,melting point, etc.). A failure mechanism that involves many thermalcycles and corresponding numerous stress cycles that eventually resultin failure/detrimental damage can be referred to as a protracted failuremechanism. A primary factor in a protracted failure mechanism istypically more a focus on a large number of cyclical rises and falls intemperature rather than the rate of temperature change (e.g., perelectron beam pulse, etc.) or the amount of temperature change. In oneembodiment, catastrophic failure mechanisms cause a failure in 1,000thermal cycles or less and protracted failure mechanisms cause a failurein more than 1,000 thermal cycles. In one embodiment, a single or fewthermal cycles with relatively low temperature changes are not typicallyproblematic. It is appreciated that as a general proposition, thedifferent failure mechanisms can involve different durations/timesbetween the initial introduction of an underlying/root cause of afailure (e.g., electron beam pulse, thermal cycle, stress/strain, etc.)and the point at which a high intensity target fails. In one embodiment,catastrophic failure mechanisms are associated with what is consideredsubstantially instantaneous failure under static load and prolongedfailure mechanisms are associated with what is considered prolongedincremental deteriorating cyclical loads that eventually lead tofailure.

While catastrophic failure mechanisms and prolonged failure mechanismscan be considered different, it is appreciated that catastrophic failuremechanisms and prolonged failure mechanisms are not necessarily mutuallyexclusive in every possible failure of a target. It is also appreciatedthat sometimes in general vernacular catastrophic failure means suddenand debilitating, and that in prolonged failure mechanisms involvingfatigue the actual failure (e.g., breaking apart, etc.) may appear tohappen suddenly (e.g., within a few cycles, within a short duration,within the 5 cycles between cycle 1,750,000 and cycle 1,750,005, etc.)with debilitating impacts. However, the application of theunderlying/root cause (e.g., electron beam pulses, thermal cycles, etc.)in the prolonged failure mechanism can occur over a relatively longduration/many cycles (e.g., from 0 to 1,750,005 cycles, etc.).

In addition, to the extent conventional approaches may coincidentallyavoid catastrophic failure mechanism problems (e.g., melting, etc.),traditionally catastrophic failure mechanisms were not thecontrolling/primary focus in traditional systems, rather traditionalapproaches mainly focused on prolonged failure mechanisms involvingfatigue. Traditional target operation parameter and conditionlimitations controlled by or based on prolonged failure mechanisms andhigh lifetime cycles may operate under particular conditions (e.g., lowtemperature, low percent strain, very infrequent target removal, etc.)that may coincidentally avoid catastrophic failure. However, importantlythe traditional target approaches (e.g., operation limits primarilybased on/controlled by considerations such as prolonged fatigue failuremechanisms, low currents, low temperatures, etc.) cannot typicallygenerate dose rates greater than 1 Gy/s.

In one embodiment, even though protracted fatigue failure mechanisms donot control/dictate limits on operating parameters and conditions for ahigh intensity target, having catastrophic failure mechanismscontrol/dictate limits on operating parameters and conditions can alsoavoid protracted fatigue failure mechanisms problems. In one exemplaryimplementation, a high intensity target is replaced before protractedfatigue failure mechanisms cause problems or issues. In one exemplaryimplementation, replacement based on or controlled by limits associatedwith catastrophic failure mechanism, a target may suffer catastrophicfailure if used for more than 1000 cycles and thus a replacementschedule limitation may indicate to replace the target at or before 1000cycles (the replacement is based upon and controlled by the catastrophicfailure limits). The target may also have failure limitations associatedwith protracted fatigue failure mechanisms. For example, the target maysuffer protracted fatigue failures after 1,000,000 cycles. In oneembodiment, catastrophic failure mechanisms cause a failure in 1,000thermal cycles or less and protracted fatigue failure mechanisms cause afailure in more than 1,000 cycles. There can be different sets ofconditions, and a target may suffer catastrophic failure under a firstset of conditions (high pulse rate, high current, high temperature,etc.) and protracted fatigue failure under a second set of conditions(low pulse rate, low current, low temperature etc.). The fact thatreplacing the target after 1,000 cycles may also coincidentally avoidlimits associated with fatigue failures (e.g., after 1,000,000 cycles)does not mean a replacement is based upon fatigue failure mechanisms,rather the controlling factor in scheduled replacement is based uponcatastrophic failure mechanisms.

As indicated above, it is appreciated the electron beam energy can bedelivered to a high intensity target in cycles of multiple pulses. It isalso appreciated that the thermal cycle temperature rise and fall cancorrespond to the energy pulse and cycle delivery. In one embodiment, apower cycle corresponds to a thermal cycle (e.g., applying and removingthermal energy, etc.). A thermal cycle can occur when temperature risesand falls as power is turned on and off. FIG. 3B is an exemplary graphindicating temperature of a high intensity target over time when beingimpacted by particles in accordance with one embodiment. FIG. 3Billustrates maximum temperature cycles (e.g., 311-319, 335, etc.) inTungsten, Braze, and Copper for a 6 MeV beam in accordance with oneembodiment. In one embodiment, the maximum current of an electron beamimpacting a target is 150 (mA) at a pulse repetition rate of 360 (Hz)and an electron beam spot size is 2 (mm). In 2.8 (ms) the maxtemperature in the tungsten button drops by 780 (C). In one embodiment,nearly the entire energy of the beam pulse is converted into temperaturerise of the impacted high intensity target material and absorbed by thatparticle beam impact location. The temperature jump ΔT is thereforemainly a function of the impact spot thermal capacity (C) and the energydelivered per pulse (E). In one embodiment, the change/delta intemperature is approximately equal to the energy delivered per pulsedivided by impact spot thermal capacity (e.g., ΔT≅E/C). There is no ornegligible heat transfer (e.g., dissipation, conduction to portions of ahigh intensity target outside the beam impact location, etc.) during apulse (heat transfer outside the beam impact location requiressignificantly more time than pulse duration). In one exemplaryimplementation, the graph shows how the temperature characteristics onthree key locations of the target evolve with time over the first fewparticle beam pulses. As indicated above, the changes in temperature cancause impacts associated with failure mechanisms and in order toreliably provide radiation treatment attention should be given tofailure limitations.

FIG. 3C is a graphical representation of an example of a failurelimitation curve illustrated in terms of electron beam impacts vscorresponding strains in accordance with one embodiment. The horizontalX-axis corresponds to the target life in terms of electron beam impactcycles. The vertical Y-axis corresponds to the amount strain (%)associated with the electron beam impact cycles. In one embodiment, ahigh intensity target can have a catastrophic failure strain percentagein the range of 0.5 to 4.0 percent. The solid black curve line 350indicates a failure limitation curve, and targets operating atparameters/values above the failure limitation curve line are likely tofail. Since, as a general proposition increases in stress/strain resultfrom increases in temperature changes caused by electron beam energy, inone embodiment the Y-axis can be considered to have a correlation toelectron beam energy. The dashed black curve line 355 indicates thegeneral relationship between an electron beam energy curve and thefailure limitation curve line 350. Low cycle fatigue region 330 is shownin light blue shade and high cycle fatigue region 340 is shown in darkblue.

Typically, traditional targets are not able to handle the thermal cyclechanges (e.g., similar to those illustrated in FIG. 3B, etc.) andresulting strains (e.g., similar to those illustrated in FIG. 3C, etc.)associated with high electron beam energy impacts. This dictates thatoperation of traditional targets is typically limited to a High CycleFatigue (HCF) regime (e.g., region 340 in FIG. 3C, etc.). As illustratedin FIG. 3C, allowable strains within a traditional target must beseveral times lower than in a Low Cycle Fatigue (LCF) regime 330 of ahigh intensity target. In addition, the HCF reliability regime of atraditional target also places other constraints on the maximumallowable electron beam power compared to LCF reliability regimes of ahigh intensity target, as illustrated in Table 1 below.

TABLE 1 Multi-Use Long Lifetime Disposable Intensity Traditional TargetTarget (HCF regime) (LCF regime) Maximum allowable RecrystallizationMelting Point temperature in Temperature Approximately tungsten button.Approximately 1,350 C. 3,400 C. Maximum allowable Solidus ApproximatelyNot Applicable temperature in Braze 1,000 C. layer. Maximum allowableMaterial softens almost Melting temperature of temperature in linearlywith the material substrate. temperature.

With reference still to FIG. 3C, the HCF region 340 below the failureline 350 corresponds to a high quantity of cycles with low strain. Aportion of the LCF region 330 close to the failure line 350corresponding to a low quantity of cycles with high strain. The highstrain tolerance enables the high intensity target to reliably functionin a region (shown in green) with high current and electron beam energycharacteristics corresponding to high dose rates (e.g., FLASH, etc.). Inone embodiment, electron beam energy and current are controlled toprevent a significant rise in temperature value at a fast rate in a veryshort time (e.g., within one or few pulses or cycles, etc.), otherwisethe high intensity target can potentially experience a thermal shockfailure (shown in red).

In one embodiment, a high intensity target system and method includesseveral novel features that enable realization of photon or X-ray basedhigh dose rate therapies (e.g., greater than 1 Gy/s, FLASH, etc.). Thehigh intensity target system and method novel features/configurationscan include movable target characteristics, replaceable targetcharacteristics, adjustable SAD, and coordinated utilization of multipleaccelerators. Additional explanation of the high intensity target systemand method novel features/configurations as described in other portionsof the detailed description.

Movable High Intensity Target

In one embodiment, a moveable high intensity target includes novelfeatures and characteristics that overcome many of the traditionalissues/problems associated with temperature rises (e.g., similar tothose illustrated in FIG. 3B) and failure limitations (e.g., similar tothose illustrated in FIG. 3C). With reference back to FIG. 3C, aspreviously explained during the few microseconds of beam pulse durationno or negligible heat is conducted away from the initial particle beamimpact location since thermal conduction typically occurs on a muchslower timescale of milliseconds. In one embodiment, a location theparticle beam impacts on a high intensity target is changed/moved from afirst location to a second location so that a later beam pulse hits thesecond location. In one embodiment, the change from the first locationto the second location occurs at a rate faster than the thermalconduction rate of the high intensity target. Thus, the second locationdoes not have heat build-up and corresponding raised temperature effectsassociated with heat conduction from the first location the particlebeam impacted. Since the second location is not experiencing temperatureeffects conducted from the first location, in one embodiment initiationof an electron beam pulse impact can be directed at the second locationwithout concerns for heat effects from prior particle beam pulses,unlike traditional targets. In order for conventional stationary targetsto operate reliably and avoid various failure limitations it is usuallynecessary to wait several milliseconds to allow the target temperatureto decay before the next beam pulse is delivered. This typically limitsacceptable pulse repetition rates in traditional systems to a fewhundred pulses per second. Thus, typical traditional pulse and energyconstraints prevent realization of photon or X-ray based high dose ratetherapies (e.g., FLASH, etc.).

However, rather than waiting for the temperature to sufficiently decayin an electron beam impact location, a high intensity target system canchange/move the electron beam impact location. In one embodiment,movement of an electron beam impact location on a high intensity targetcan vary (e.g., moved in a step function, continuously moved duringtreatment, etc.). In one embodiment, the number of pluses that hit animpact location before/while a high intensity target is moved can vary(e.g., a single pulse, multiple pulses, a cycle of pulses, etc.). In oneembodiment, movement of an electron beam impact location and a highintensity target can vary (e.g., moved in a step function, continuouslymoved during treatment, etc.). The different location can be a newlocation that has not been impacted by a previous pulse. The differentlocation can be a location that was hit by a previous pulse but hassufficiently recovered (e.g., enough time has passed for theheat/temperature associated with the previous pulse to have sufficientlybeen dissipated/reduced, etc.). In one exemplary implementation, thedifferent location has sufficient thermal capacity to handle/absorb thenew pulse energy without melting.

It is appreciated that while it may appear there are some similaritiesbetween traditional target approaches and new high intensity targetsystems and methods, in reality there are numerous significant novel andnon-obvious differences. In one embodiment, high intensity targetsystems and methods are configured with failure limitations basedprimarily on catastrophic failure mechanisms rather than protractedfatigue failure mechanisms, unlike traditional approaches. Additionaldiscussion on different aspects of high intensity target systems andmethods are presented in other portions of this detail descriptionsection.

FIG. 4 is a block diagram of particle beam impact locations on a highintensity target 3500 surface in accordance with one embodiment. Theimpact locations can have various configurations. The impact locations3521 through 3528 are adjacent to one another. The impact locations 3531through 3538 have spaces between one another. The impact locations 3541through 3548 overlap one another. The footprint or outline of theparticle beam impact locations can have different shapes (e.g., square,circle, rectangle, etc.). In one embodiment, regardless of the impactlocation configuration, movement of the location of charged particleimpact is based on thermal diffusion and is moved at a rate greater thandiffusion of detrimental heat impacts on the replaceable high intensitytarget. In one exemplary implementation, the speed or rate of targetmovement is not less than the speed at which the thermal power in thetarget travels by diffusion. As explained above, this can avoid run-awaystack up of temperature jumps.

In one embodiment, an electron beam impact overlap occurs when a portionof a previous electron beam pulse impact and a subsequent electron beampulse impact hit the same surface area of a target while heat effectsassociated with the previous electron beam pulse is still present in thelocation. In one exemplary implementation, an energy per pulse value forthe electron beam is picked to account for an overlap in impactlocations. In one embodiment, the energy per pulse value for theelectron beam is selected so that the high intensity target does notsuffer a failure and is unable to provide reliable radiation generation.

FIG. 5 is a block diagram of an exemplary adjustment of a particleimpact location on a high intensity target 3600 in accordance with oneembodiment. High intensity target 3600 includes particle impactlocations 3640 and 3650. Particle impact locations 3640 and 3650 areshown as adjacent locations similar to impact locations 3521 through3528 in FIG. 4 . It is appreciated that the movement of impact locationscan also apply to impact locations that have spaces between one another(e.g., similar to 3531 through 3538 in FIG. 4 , etc.), impact locationsthat overlap one another (e.g., similar to 3541 through 3548 in FIG. 4 ,etc.) and so on. The particles from particle beam 3620 collide withmolecules in high intensity target 3600 resulting in the release ofenergy as radiation and heat. During a first time period particle beam3620 impacts replaceable high intensity target 3600 in particle impactlocation 3640. The particle beam 3620 penetrates into the high intensitytarget material and then diffuses radially outwards. The resulting heatis dispersed in region 3680 with the heat spread from a surfaceperspective shown as 3680A and the heat spread into high intensitytarget 3600 shown as 3680B.

During a second time period (e.g., before detrimental heat spread canreach the boundaries of particle impact location 3650) the impact ofparticle beam 3620 is adjusted or moved to particle impact location3650. In one embodiment, the particle impact location is adjusted bymoving the high intensity target 3600 in the direction 3699 until theparticle beam 3620 is in particle impact location 3650. The resultingheat is dispersed in region 3690 with the heat spread from a surfaceperspective shown as 3690A and the heat spread into high intensitytarget 3600 shown as 3690B. In one exemplary implementation, the heatimpact 3680 significantly dissipates and is substantially gone fromparticle impact location 3640 during the second or future time period.

In one embodiment, the number of pluses that hit an impact locationbefore/while a high intensity target is moved can vary (e.g., a singlepulse, multiple pulses, a cycle of pulses, etc.). In one exemplaryimplementation, a single pulse 311 hits particle impact location 3640and the target is moved so that the next pulse 312 hits particle impactlocation 3650. In one exemplary implementation, a first plurality ofpulses (e.g., 311, 312, 313, 314, etc.) hit particle impact location3640 and the target is moved so that the next plurality of pulses (e.g.,315, 316, 317, 318, etc.) hit particle impact location 3650. It isappreciated that the number of cycles/pulses that can impact a highintensity target before reaching failure limits (e.g., less than pulse335, more than pulse 335, etc.) can change based upon various things(e.g., type of high intensity target material, configuration of the highintensity target, energy level of electron beam impacting the highintensity target, etc.).

It is appreciated a high intensity target can have a variety ofconfigurations. The configurations can provide additional assistance/aidto various radiation system operations (e.g., achieving radiationgeneration characteristics, dose rates, target insertion ejection,target movement, etc.,) beyond simple generation of Bremsstrahlungradiation. The changes can lead to a difference in the actualconfiguration (material, shape, size, etc.) of the target relative totraditional approaches. For example, a high intensity target can bestructurally different (e.g., different material, etc.) than atraditional target.

It is appreciated a high intensity target can include various materials.Different regions or portion of a high intensity target can be made ofdifferent composition and have different characteristics in differentregions/locations. In some embodiments, the components of a highintensity target can have various characteristics including one or moreof the following: a layer of high atomic number material having highdensity, a layer of low atomic number, and low density material, highheat capacity, high thermal conductivity, high melting point, highboiling point, high electrical conductivity, high yield strength,physical properties relatively unaffected by radiation (radiation hardor Rad-hard), noncorrosive, and so on. The high intensity target can beconfigured with various materials (e.g., beryllium, titanium, carbon,copper, tungsten, braze, etc.). Coordinated configuration of a highintensity target can facilitate enhanced performance

In one embodiment, a high intensity target includes various materials(e.g., copper, steel, tungsten, etc.). In one exemplary implementation,a high intensity target includes at least 80 percent of one material byatomic weight. The high intensity target can be a monolithic structureand remaining portions can be impurities by atomic weight. A highintensity target can include 95 to 99.7 percent copper by atomic weight;and 0.3 to 5 percent impurities by atomic weight. A high intensitytarget can be steel based and include 95 to 99.7 percent iron by atomicweight; and 0.3 to 5 percent impurities by atomic weight. A highintensity target can include 95 to 99.9 percent Tungsten by atomicweight; and 0.1 to 5 percent impurities by atomic weight. It isappreciated a replaceable high intensity target can include variouscombinations of material (e.g., Tungsten and Steel, Cooper and Steel,Tungsten and Copper, etc.). The combinations can be made with variousjoining techniques (e.g., brazing, welding, back casting, etc.). A highintensity target can include alloys. In one exemplary implementation, ahigh intensity target includes at least 80 percent of an alloy byweight.

A high intensity target can have different configurations includingvarying contours (e.g., bumps, ridges, etc.), shapes, and thicknessesbased upon heating characteristics of the replaceable high intensitytarget. In one embodiment, a high intensity target is thick enough tostop a high energy electron beam while thin enough to avoidself-attenuation. The contours, shape, and thicknesses can be configuredto mitigate detrimental heating characteristics and disbursement issues.The contours, shapes, and thicknesses can be configured for radioactiveemission characteristics. In some embodiments, the contours, shapes, andthicknesses can be configured for radiation resistance or blockingability. In some embodiments, a high intensity target enables increasedcontrollability and performance over conventional Xray targetapplications.

In addition, the target does not have to include a tungsten layer orcopper substrate. Reduced cost of the high intensity target can beachieved by using all copper targets, such as used for the 8× and 10×modes on a Varian TrueBeam for example, or by replacing the coppersubstrate with less expensive materials, such as steel for example. Thehigh intensity target can be configured to collaboratively contribute toradiation emission, energy absorption, heat dissipation, and so on. Inone embodiment, a high intensity target can be configured to handle 200pulses in 2 mm particle impact locations and have a total length ofapproximately 0.04 m long.

In one embodiment, a high intensity target is configured in layers. Thelayers can have different characteristics (e.g., radiation generationcapability, z value, heat dissipation, heat transfer, melting points,thermal strain characteristics, etc.). FIG. 6 is a block diagram ofexemplary configurations of high intensity targets in accordance withone embodiment. High intensity target 3751 is a single layer 3752comprising a single layer configuration of the same substance (e.g.,metal, compound, alloy, etc.). High intensity target 3871 is a multiplelayer configuration. High intensity target 3871 includes layer 3872 andlayer 3873. In one embodiment, layer 3872 and layer 3873 includedifferent substances. In one embodiment, layer 3872 and layer 3873include the same substances.

FIG. 7 is a block diagram of a high intensity target 3700 in accordancewith one embodiment. In one embodiment, high intensity target 3700 issimilar to high intensity target 3600. High intensity target 3700includes particle impact locations 3740 and 3750. The particle beam 3720penetrates into the high intensity target material and then diffusesradially outwards. The resulting heat is dispersed in region 3780 withthe heat spread from a surface perspective shown as 3780A and the heatspread into high intensity target 3710 shown as 3780B. Buffer zone 3710can help prevent/deter the diffusion/spread of heat into that area ofparticle impact location 3750, and vice versa. In one embodiment, highintensity target features and characteristics (e.g., configuration,substance, shape, contour, material, etc.) enables buffer zone 3710 tohelp prevent/deter heat diffusion/spread.

FIG. 8 is block diagram of high intensity target configurations inaccordance with one embodiment. High intensity target 3910 includeslayers 3911 and 3912. In one embodiment, layer 3911 includes substance Aand layer 3912 includes substance B. In one embodiment, high intensitytarget 3910 includes higher concentrations of substance A in an impactzone and higher concentrations of substance B in a buffer zone. In oneembodiment, substance A is a high radiation generation substance andsubstance B is resistant to heat dissipation. High intensity target 3920includes portions or zones comprising substance A (e.g., 3921, etc.) andportions or zones comprising substance B (e.g., 3922, etc.). The contourof the substances can be configured to align with particle impactlocations/zones and buffer areas. In one embodiment, high intensitytarget 3930 includes portions or zones comprising substance A (e.g.,39931, etc.), portions or zones comprising substance B (e.g., 3932,etc.), and portions or zones comprising substance C (e.g., 3939, etc.).In one exemplary implementation, substance A can act as a substrate,substance B can act as particle beam impact location, and substance Careas can act as a heat transfer buffer.

FIG. 9 is a block diagram of exemplary high intensity target 4010 inaccordance with one embodiment. Replaceable high intensity target 4010includes layers 4021 and 4031. In one embodiment, the surface contoursof high intensity target 4010 can help prevent/deter thediffusion/spread of heat within the replaceable high intensity target4010. In one exemplary implementation, the contours create air gapsbetween particle impact locations/zones. In one embodiment, the surfacecontours of replaceable high intensity target 4010 can also help promoteor aid the release/emission of heat from the replaceable high intensitytarget 4010. In one exemplary implementation, the contours create aradiation effect that helps release heat from the replaceable highintensity target 4010.

FIG. 10 is a block diagram illustrating the movement of a replaceablehigh intensity target in accordance with one embodiment. A particle beam4110 impacts high intensity target 4120. Replaceable high intensitytarget 4120 is moved at a target velocity of 4180 so that particleimpact from particle beam 4110 traverses from particle impact location#1 to particle impact location #2. The movement traverses the particleimpact locations up to and including particle impact locations #N−1 and#N along a length 4170 of the high intensity target. In one exemplaryimplementation, the length 4170 the particle beam 4110 traverses isequal to the velocity times a treatment duration. In one exemplaryimplementation, the length the particle beam 4110 traverses beforechanging direction is a portion/fraction of overall length 4170. In oneembodiment, location of charged particle impacts on the replaceable highintensity target is changed at a speed of greater than or equal to 0.3meters per second.

It is appreciated that particle impact adjustment motions or patterns ona high intensity target can vary. FIG. 11 is a block diagram ofexemplary particle impact adjustment motions or patterns in accordancewith one embodiment. A replaceable high intensity target 4210 isadjusted so that particle beam 4280 traverses the particle impactlocation 4220, 4230, 4240, and 4250. Particle beam 4280 can move in auniaxial linear motion 4271 (e.g., from particle location 4220 to 4230and 4230 to 4220, or alternatively from particle location 4220 to 4240and 4240 to 4220, etc.). Particle beam 4280 can move in a multi stagemotion 4272 (e.g., from particle location 4220 to 4230, 4230 to 4220,4220 to 4240, 4250 to 4230, 4250 to 4240, etc.). Particle beam 4280 canmove in a circular motion 4273 (e.g., from particle location 4220 to4230 to 4250 to 4240 to 4220, or from particle location 4220 to 4240 to4250 to 4230 to 4220, etc.). The movement of a location charged particleimpact on a high intensity target can be based upon various factors(e.g., melting temperature, power limits, etc.).

In one embodiment, a replaceable high intensity target travels betweenpulses so that each electron beam pulse hits a new, previouslynon-impacted spot (see FIG. 4, 5 , etc.). In one exemplaryimplementation, a pulse repetition rate can be 500 pulses per second(pps). In one exemplary implementation, for a pulse repetition rate of1,800 pps, the target can move at a linear speed of approximately 5 m/s.In one exemplary implementation, for a pulse repetition rate of lessthan 1,000 pps the translation speed would be approximately 3 m/s. Thisis well in the range of high speed linear actuators and on the low endof what can be achieved with conventional rotating mechanisms. In oneexemplary implementation, for a 10 cm diameter track, a rotational speedof only 20 Hz or 1,200 rpm is utilized. It would then take 50 ms beforea previously exposed spot would be hit again. This can be sufficienttime for the deposited energy from the previous pulse to dissipatethrough the material. In one embodiment, a 20 Gy treatment utilizes 6revolutions per target, placing it well into the Low Cycle Fatigue (LCF)regime.

FIG. 12 is a graphical representation example for a thermal profile of anon-moving conventional Xray target. The graphical representationillustrates how the thermal profile within the target evolves with eachadditional pulse. In one embodiment, the temperature and plastic strainmaps correspond to utilization of a fixed 6 MeV target. In one exemplaryimplementation, the max target current is 150 mA, the repetition rate is360 Hz, and the beam spot size is 2 mm.

FIG. 13 is a graphical representation of an example maximum plasticstrain map for a moving target in accordance with one embodiment. Thecenter of the impact regions (e.g., 910, 920, etc.) show the relativeincrease to greater than 5% equivalent plastic strain. In oneembodiment, the max target current is 275 mA, the repetition rate is 650Hz, and the beam spot size is 2 mm.

FIG. 14 is a graphical representation of an example maximum temperaturefor a moving target in accordance with one embodiment. The center of theimpact regions (e.g., 1010, 1020, etc.) show the relative increase toregions with greater than 1973K (1700 C) temperature.

FIGS. 13 and 14 illustrate that in one embodiment an adjustment in theparticle beam impact location on a high intensity target of 2-3 mmin-between pulses is enough to avoid melting of target material.

FIG. 15 is block diagram of a high intensity target system 3000A inaccordance with one embodiment. High intensity target system 3000Aincludes target location control component 3010. In one embodiment,target location control component 3010 is similar to target locationcontrol component 119 in FIG. 1 . Target location control component 3010includes a mechanism for controlling the movement of the high intensitytargets. It is appreciated that target location control component 3010can include various types of mechanisms for controlling the movement ofthe high intensity targets (e.g., roller, ball, belt, rack and pinion,spring, pneumatic, electronic actuator, etc.). In one embodiment, targetlocation control component 3010 includes mechanism 3011A and 3011B forcontrolling adjustments or movements of high intensity target 3020.Target location control component 3010 can be used to assist loading andunloading of target 3020 (e.g., from a location shown in dashed linesoutside accelerator enclosure 3005 to a location within acceleratorenclosure 3005, etc.). In one exemplary implementation, access component3007 can be used to permit/deny access to accelerator enclosure 3005.Target location control component 3010 adjusts high intensity target3020 into a position to be impacted by particle beam 3091 and generateX-ray beams (e.g., 3092, etc.). During a first time period highintensity target 3020 is adjusted/moved so that particle beam 3091impacts location 3022 and during a second time period high intensitytarget 3020 is adjusted/moved so that particle beam 3091 impactslocation 3021, or vice versa. High intensity target 3020 can beadjusted/moved so that particle beam 3091 impacts various locations indifferent configurations (e.g., adjacent, overlapping, separated,similar to FIG. 4 , etc.). In one embodiment, a high intensity target ismoved to and from a location (e.g., 3022, 3022, etc.) multiple times.

It is appreciated the target can be moved by an automated movementsystem. FIG. 16 is a block diagram of an exemplary target movementsystem 3100 in a first configuration 3100A and second configuration3100B in accordance with one embodiment. The target movement controlcomponent 3107 and movement coupling mechanism 3109 can be located in anaccelerator enclosure (not shown). The movement coupling mechanism 3109can be a releasable coupling mechanism (e.g., grabbing, clamping,clasping, etc.) that selectively couples with holding component 3100(that holds high intensity target 3151) in configuration 3100A andselectively couples with high intensity target 3152 in configuration3100B. In one embodiment, a holding component and high intensity targetcan include holding/moving assist features to help the holdingcomponent/moving system engage with the holding component and highintensity target. In one exemplary implementation, holding component3010 and high intensity target 3151 are configured with a coupling aid(e.g., notch, grasping, clamping, etc.) that also acts as aholding/moving assist feature.

FIG. 17 is a block diagram of an exemplary rack and pion movement system3300 in accordance with one embodiment. Rack and pion movement system3300 includes target holding component 3310 that is moved in a plane.Holding component 3310 holds replaceable high intensity target 3350.Rack 3311 moves the holding component 3310 in a first direction in theplane based upon rotation of the pinion 3312 and rack 3321 moves theholding component 3310 in a second direction in the plane based uponrotation of the pinion 3322.

With reference back to FIG. 1 , the target location control component119 is configured to control the impact location of particles on thereplaceable high intensity target 117. In one embodiment, the targetlocation control component 119 adjusts/moves the replaceable highintensity target 117 resulting in adjustments to the location ofparticle impact on the replaceable high intensity target 117. In oneembodiment, the target location control component 119 can use othermechanisms (e.g., adjustments to the particle beam, the particle source111, the acceleration portion 115, etc.) to cause adjustments to thelocation of particle impact on the high intensity target 117. In oneexemplary implementation the particle beam is manipulated (e.g., bent,steered, etc.). In one embodiment, adjustments in the location ofparticle impact on the replaceable high intensity target 117 are basedupon heat generated by the impact and collision with the replaceablehigh intensity target 114 components. Additional description ofadjustments to the location of particle impact on the replaceable highintensity targets is presented in other portions of this specification.

As previously mentioned, charged electron collisions with high intensitytargets can result in thermal impacts that can cause localized damage ina high intensity target. In one embodiment, even though electron beamimpact locations can be changed/moved to help reduce/mitigate theoccurrence and extent of localized damage, when operating at high energylevels some localized damage may occur. The amount of localized damagethat occurs with an electron beam pulse can vary (e.g., based upon powerlevel, duration, target material, etc.). In one exemplaryimplementation, an impact location can take multiple applications of apulsed high energy electron beam before the localized damage reaches alevel of unacceptably interfering with reliable radiation generation anddelivery. In one exemplary implementation, an electron beam can returnto an impact location multiple times (e.g., up to a number wheredetrimental impacts begin to reach a level of unacceptably interferingwith reliable radiation generation and delivery). It is appreciated,that high intensity target approaches for dealing with potentiallocalized impacts are compatible with various adjustments schemes andregimes.

In one embodiment, efficiently and effectively dealing with localizeddamage includes addressing failure limitations. The failure limitationscan be associated with a point at which a loss of either reliableradiation delivery performance at relatively high dose rates (e.g.,greater than 1 Gy/s, etc.) or overall system integrity maintenanceoccurs. In one embodiment, failure limitations can be associated withdifferent failure mechanisms. With reference back to FIG. 3C, it isappreciated that a high intensity target with movable electron beamimpact locations can reliably operate at higher energy levels, the highintensity target can be at risk of failure when operating above thefailure curve in the low cycle fatigue region. In one embodiment, a highintensity target is readily replaceable at a “life time” correspondingto a low cycle value (e.g., 1,000 or less electron beam pulse cycles,etc.).

FIG. 18 is a flow chart of an example high intensity target method 4700in accordance with one embodiment. In one embodiment, high intensitytarget method 4700 includes processes for efficiently and effectivelydealing with localized damage that can be associated with increased doserates (e.g., greater than 1 Gy/s, etc.) and increased power levels(e.g., greater than 1 Mev, etc.). In one exemplary implementation, highintensity target method 4700 includes changing/moving particle impactlocations and replacing high intensity targets.

In block 4710, a charged particle is generated.

In block 4720, the charged particle is accelerated.

In block 4730, radiation is generated in response to impact by thecharged particle on a high intensity target.

In block 4740, an impact location of the charged particle on the highintensity target is changed. The change in the impact location is inpart based upon heat generation resulting from the impact of the chargedparticle on the high intensity target and generation of the radiation.

In block 4750, the high intensity target is selectively inserted andremoved to and from use. In one embodiment, the high intensity target isremoved after 5 treatment uses. In one exemplary implementation, a highintensity target is disposed of after removal. The inserting andremoving of the high intensity target can be performed automatically.

High intensity target systems and methods can have various operationalaspects (e.g., actions, features, components, scheduling,characteristics, etc.) that are different from traditional systems andmethods. Unlike typical conventional Xray targets, a high intensitytarget can operate under a catastrophic failure mechanism regime and inthe LCF region. In one embodiment, a high intensity target with aproduct life in the LCF regime range can therefore be pushedsignificantly harder with respect to energy and temperature levels thana traditional target since a high intensity target only has to withstandcatastrophic failure mechanism energy and cycle limitations instead ofmore stringent energy and cycle limitations associated with protractedfailure mechanisms and cyclical fatigue. In one exemplaryimplementation, a high intensity target only needs to last a limitednumber of thermal cycles before it fails. In one embodiment, a changefrom a HCF to the LCF regime can allow approximately a doubling ofenergy deposition per electron beam pulse. In one embodiment, a LCFregime means increasing the allowable dose per pulse. In one exemplaryimplementation, there is at least a doubling of beam current or pulsewidth and hence at least doubling of the dose rate. A change from a HCFto the LCF regime can allow a power limit to be set by or based uponmelting temperature of a material which constitutes at least a portionof a high intensity target rather than cyclical fatigue/strainlimitations. In one embodiment, a switch from a HCF to a LCF regimemeans a target needs to accommodate different replacement regimes.

High intensity targets can accommodate replacement regimes associatedwith operations and performance subject to catastrophic failuremechanisms and LCF regimes. In one embodiment, replacement regimes of ahigh intensity target are different (e.g., easy, fast, convenient,simple, less effort, etc.) compared to traditional approaches. Highintensity target system and method replacement regimes can differ inreplacement initiation triggers and ease of target loading/unloading. Inone embodiment, the occurrence of replacement of the replaceable highintensity target is based upon thermal shock rather than cycleprotracted fatigue failure. Additional discussion on different aspectsof high intensity target systems and methods are presented in otherportions of this detail description section.

Various aspects of high intensity target system and method replacementregimes can be different than conventional approaches. Various targetreplacement metrics can be used to measure/indicate when initiation oftarget replacement should commence (e.g., a particular predetermineddate/time, before a particular event/activity, before a certain numberof radiation pulses, before a certain number of treatments, etc.). Therecan be shorter durations between scheduled replacements of a highintensity target (e.g., less than or equal to a month, less than orequal to a week, less than or equal to 2 days, etc.), unlike aconventional system or method that waits a significant time (e.g.,multiple years, decades, etc.) before a target is removed. There can beless radiation activities (e.g., less than or equal to 10,000 pulses,less than or equal to 1 million pulses, less than or equal to 10,000Monitor Units (MU), etc.) between replacements of a high intensitytarget than a typical traditional target approach. There can be lesspatient treatment activities (e.g., less than 100 treatments, less than3 treatments, one treatment, etc.) between replacements of a highintensity target than a typical traditional target approach. In oneexemplary implementation (e.g., see FIG. 3C, etc.), a high intensitytarget operating in an LCF regime is scheduled for replacement at theend of the LCF life range (e.g., under 1,000 use cycles, etc.) versus atraditional approach schedule operating in a HCF regime scheduled forreplacement at the end of the HCF life range (e.g., above 100,000 usecycles, etc.).

In one embodiment, a high intensity target replacement is very differentthan conventional assembly/disassembly of the accelerator enclosure andremoval/attachment of a target by a user. A high intensity target systemand method can involve simple access to the target without involvingother radiation components. A prior art target removal/repair typicallyinvolves significant assembly/disassembly of an accelerator enclosurethat gains general access to multiple components and can require removalof other components (e.g., radiation shielding, drive mechanism, etc.).In one embodiment, a high intensity target is easily replaceable.

In one embodiment, a high intensity target replacement is very differentthan conventional assembly/disassembly of the accelerator enclosure andremoval/attachment of a target by a user. A high intensity target systemand method can involve simple access to the target without involvingother radiation components. The novel convenient configuration canenable the high intensity target systems and methods to efficiently andeffectively execute the new replacement regimes.

In one exemplary implementation, replacement includes loading andunloading a high intensity target to and from an accelerator enclosuresystem. High intensity target loading and unloading can have variousoperational aspects (e.g., actions, features, components,characteristics, etc.).

The loading/unloading can include access activities (e.g., accessing apart of a radiation system, accessing an operational location, accessingan accelerator enclosure, etc.). The loading/unloading can also includeactivities associated with holding a high intensity target in a mannerthat prevents unintended movement (e.g., displacement, dislocation,dislodgement, etc.).

The different loading/unloading aspects of high intensity target systemsand methods can include various implementations. One loading/unloadingaspect is providing/taking away a high intensity target to/from anaccelerator enclosure (e.g., a single target, multiple targets in acartridge, etc.). Another loading/unloading aspect is injecting/ejectingan individual high intensity target into/out of an intended operationallocation (e.g., inside an accelerator enclosure, etc.). The differentloading/unloading aspects can be implemented as actions or steps. Theactions or steps can be implemented various ways (e.g., single actions,multiple actions, combined actions, separate action, continuous action,discrete, etc.).

In one embodiment, a user loads/unloads a single high intensity targetin one continuous single step by accessing the operational location,ejecting a used high intensity target from the operational location,providing a new high intensity target by injecting it into theoperational location, closing the access, and taking away/disposing theused high intensity target. In one exemplary implementation, the highintensity target is loaded/unloaded to or from a target holdingcomponent. The target holding component can move the high intensitytarget to an operational location and electron beam impact positionswithin the operational location.

In another embodiment, a user loads/unloads a plurality of highintensity targets in multiple separate distinct steps. In a first step auser provides a cartridge full of a plurality of high intensity targetsto a radiation system and takes away a container with used highintensity targets. In some embodiments, later in separate distinct stepsmultiple openings/closings of an access to the operational location areimplemented to allow insertion and ejection of the individual highintensity targets. When an access component permits access (e.g., isopen, engaged, etc.) respective ones of the plurality of high intensitytargets can be individually inserted in an operational location andrespective used ones of the plurality of high intensity targets can beejected out of the operational location into an ejection container. Inone embodiment, after multiple high intensity targets have been ejectedthe ejection container can be easily removed from the acceleratorenclosure. After a target has been inserted/ejected, an access componentcan deny/restrict access (e.g., is closed, disengaged, etc.) to theoperational location. Additional detail is presented in other portionsof this detail description section.

In one embodiment, a high intensity target is easily and readilyreplaceable. In one exemplary implementation, the ease at which a highintensity target can be loaded/unloaded enables the high intensitytarget to meet new replacement regime scheduling (e.g., associated withnew operating conditions and parameter limitations, higher dose rates,etc.). In one embodiment, loading and unloading activities areeffectively and efficiently executed. The loading and unloading caninclude simple/quick activities (e.g., single action, pushing in orpulling out of operational location, dropping into or lifting out of anoperational location, etc.). In one exemplary implementation,effectively and efficiently executing loading/unloading includesinserting and ejecting a high intensity target to and from anoperational location in under 30 minutes. In one exemplaryimplementation, effectively and efficiently executing loading/unloadingincludes inserting and ejecting a high intensity target to and from aoperational location in under 5 minutes, including accessing theoperational location in under 1 minute, inserting or ejecting to/fromthe operational location under 1 minute, placing a high intensity targetin a holding component under 1 minute, and coupling a cartridge/magazineto the acceleration enclosure in under 1 minute. In one embodiment, thedurations are indicative of times of activities executed in proximity ofthe radiation system. In one exemplary implementation, the coupling of acartridge/magazine to the radiation system in under 1 minute addressesthe time expended actually coupling the cartridge to the radiationsystem. The durations do not include additional timetransporting/bringing the cartridge from a remote location (e.g.,another room, storage location, another facility, etc.) to the radiationsystem or performing quality assurance (QA).

In one embodiment, high intensity target systems and methods are easilyand readily implemented by an ordinary user. High intensity targetsystems and methods can be easy to understood/comprehended. Highintensity target loading and unloading activities can be simple andintuitive (e.g., straight forward, not complicated, etc.). In oneexemplary implementation, an ordinary user does not need sophisticated(e.g., extensive, specialized, rigorous, technical, etc.)characteristics (education, training, skills, expertise, physicalattributes, etc.) to use the high intensity target loading/unloadingsystems and methods. While high intensity target loading/unloadingsystems and methods do not need users with sophisticated characteristicsto load and unload high intensity targets, the users can havesophisticated characteristics. In one exemplary implementation, a usercan have sophisticated characteristics in other areas that are notdirectly related to radiation system assembly/disassembly. A user (e.g.,radiology technician, nurse, doctor, etc.) operating a radiation systemcan have other types of specialized characteristics (e.g., education,skills, knowledge, training, expertise, etc.) related to the operationof radiation systems and medical treatments.

It is also appreciated, that while high intensity targetloading/unloading systems and methods can be easy and convenient, itdoes not preclude establishing restrictions/authorizations regarding theuse of high intensity target loading/unloading systems and methods.While it is easy and convenient to load and unload high intensitytargets in a radiation system, proper utilization of other features ofthe radiation system (e.g., generating radiation, medical treatments,etc.) can involve complicated and sophisticated aspects. In oneembodiment, a high intensity target is utilized for important activities(e.g., medical treatments, procedures, etc.) having grave and severeconsequences if not utilized appropriately. In one exemplaryimplementation, restriction/authorizations on using high intensitytarget loading and unloading systems and methods can be limited tocertain users.

In one embodiment, a radiation accelerator system includes a targetloading system configured to assist loading and unloading of highintensity targets to and from the accelerator system. Theloading/unloading system can be configured to assist theinsertion/ejection of a high intensity target to and from an operationallocation. It is appreciated that the terms high intensity target loadingsystems and methods are naming conventions that do not necessarilypreclude unloading. In one exemplary implementation, high intensitytarget loading systems and methods can be utilized for both loading andunloading of a high intensity target. As indicated above, operationallocation access and holding a high intensity target to preventunintended movement can be included in target loading systems andmethods.

It is appreciated that high intensity target loading systems and methodscan have various implementations. High intensity target loading systemsand methods can be manual, automatic, combinations of manual andautomatic (in which some of the loading/unloading is performed manuallyand some of the loading/unloading is performed automatically). In oneembodiment, high intensity target systems and methods include mechanizedassistance for manual loading/unloading. While the specificationincludes numerous paragraphs describing aspects of high intensity targetloading systems and methods without explicitly indicating in thatparagraph whether they are manual, automatic, or a combination of manualand automatic, nevertheless it is appreciated that aspects of highintensity target loading systems and methods can be manual, automatic,or a combination of manual and automatic.

In one embodiment, a target holding system can include holdingcomponents and methods that hold or restrict a high intensity targetfrom un-intended movement. Loading and unloading (includinginjecting/ejecting) a high intensity target into/out of a target holdingsystem can be easily/readily accomplished. In one embodiment, holdingsystem/component activities (e.g., inserting, ejecting, etc.) areeffectively and efficiently executed. In one embodiment, the insertionor ejection of a high intensity target to and from a holding componentinvolves a simple/quick activity (e.g., single action, pushing in orpulling out of a holding component, dropping into or lifting out of aholding component, etc.). Target holding systems can include variousefficient handling aids (e.g., handles, tabs, etc.) that assist variousloading/unloading activity (e.g., grasping, grabbing clutching, seizing,griping, etc.). Holding systems can include various holding latches. Theholding latches can assist holding the high intensity target in a properposition within the holding system. The holding latches can include anefficient (e.g., quick, simple, single action, etc.) release typecomponent or action to engage/release the high intensity target (e.g., aclasp, clip, snap, latch, bolt, Velcro strip, door knob, handle, etc.).In one exemplary implementation, target holding system can enable a highintensity target to be loaded or unloaded in under 30 minutes. In oneexemplary implementation, target holding system can enable a highintensity target to be loaded or unloaded in under 5 minutes.

Holding systems can include various additional features. Holding systemscan include various sensors. The sensors can include position sensorsthat sense the location of a high intensity target in the holdingsystem. The sensors can provide a signal indicating if a high intensitytarget is in a proper holding position or not. The sensors can havevarious configurations. In one exemplary implementation, a highintensity target can be loaded into a position that exerts apressure/force and the sensor can sense the force/pressure. Based uponthe pressure/force the sensor can determine a correlation with theposition of the high intensity target. The sensor can be a light/laserbased sensor that senses the location of high intensity target basedupon impacts (e.g., reflection, interruption, etc.) on the light due tothe position of the high intensity target. It is appreciated thatvarious types of sensors can be utilized (electromagnetic/inductive,sound, optical, sensors that recognize features of a high intensitytarget, etc.). Additional discussion on high intensity target loadingand unloading is presented in other portions of this detail descriptionsection. In one embodiment, a sensor provides information to theaccelerator system. The accelerator system can prevent radiationgeneration and issue warnings to a user if the high intensity target isnot in the proper position.

FIG. 19 is a block diagram of an exemplary holding system 300 inaccordance with one embodiment. Holding system 300 includes holdingcomponent 310, openings 381 and 382, and sensor 370. Additionalexplanation of holding system 300 is presented in other portions of thedetailed description.

FIG. 20 is a block diagram of an exemplary holding system 900 inaccordance with one embodiment. Holding system 900 includes holdingcomponent 910, holding latch 917 and opening 988. Additional explanationof holding system 900 is presented in other portions of the detaileddescription.

FIG. 21 is a block diagram of an exemplary holding system 400 inaccordance with one embodiment. The holding system includes holdingcomponent 411 (shown as portions 411A and 411B), holding latchcomponents component 451 and 452, and sensor 430. Additional explanationof holding system 400 is presented in other portions of the detaileddescription.

FIG. 22A is a block diagram of an exemplary holding system 500 inaccordance with one embodiment. The holding system 500 includes holdingcomponent 511 (shown as portions 511A and 511B), holding latch component551, and sensor 530. Additional explanation of holding system 500 ispresented in other portions of the detailed description.

FIG. 22B is a block diagram of an exemplary holding system 600 inaccordance with one embodiment. The holding system 600 includes holdingcomponent 611 (shown as portions 611A and 611B), holding latch component651, and sensor 630. Additional explanation of holding system 600 ispresented in other portions of the detailed description.

In one embodiment, a holding system include a holding component (e.g.,310, 910,411, 511, 611, etc.) that can be placed in and out of anoperational location and hold or restrict a high intensity target (e.g.,350, 950, 450, 550, 650, etc.) from un-intended movement. In oneexemplary implementation, a holding component can include features(e.g., a guard/rail configuration such as 311, a cavity configurationsuch as 911, support lip 912, a slot configuration such as 480, etc.)that help hold the high intensity target. Holding system loading andunloading activities (inserting, ejecting, etc.) can be effectively andefficiently executed (e.g., simple, quick, etc.). A high intensitytarget can easily be put in (e.g., slid in, dropped in, pushed in, etc.)and removed (e.g., lifted out, slid out, pulled out, etc.) out of a highintensity target holding component (e.g., 310, 910, 411, 511, 611,etc.). In one exemplary implementation, a high intensity target isinserted/ejected quickly (e.g., under 30 minutes, under 5 minutes, under1 minute, under 10 seconds, etc.). It is appreciated thatinsertion/ejection time durations do not include time expended on otheractivities (e.g., performing radiation treatment, calibrating theradiation system, etc.). In one exemplary implementation withinsertion/ejection times of under a minute, a high intensity target isinserted in an operational location in under a minute, patient radiationtreatment lasts 1 hour, and the high intensity target is ejected fromthe operational location in under a minute.

Holding components/systems can be configured not to interfere withradiation generation. In one embodiment, holding components (e.g., 310,910, 411, 511, 611, etc.) can include openings/spaces that enable theholding components to avoid undesirable impacts on radiation generation.In one embodiment, a hole/space/opening (e.g., 381, 481, 581, 681, etc.)can be configured to permit charged particle beams to hit a highintensity target and another hole/space (e.g., 382, 988, 482, 582, 682,etc.) can be configured to permit radiation beams to be emitted by thehigh intensity target (e.g., 350, 950, 450, 550, 650, etc.) withoutinterference from/by holding component (e.g., 310, 910, 411, 511, 611,etc.).

Some portions of this specification describe high intensity targetloading systems and methods without explicitly reciting some aspects ofthe loading/unloading so as to avoid unnecessarily obfuscating theinvention. As previously indicated, various aspects of high intensitytarget loading systems and methods can be manual, automatic, orcombinations of manual and automatic. In one embodiment, a highintensity target (e.g., 350, 950, 450, 550, 650, etc.) is inserted toand ejected from a holding component e.g., 310, 910, 411, 511, 611,etc.) manually. In one embodiment, a high intensity target (e.g., 350,950, 450, 550, 650, etc.) is inserted to and ejected from a holdingcomponent (e.g., 310, 910, 411, 511, 611, etc.) automatically.

A holding component can include holding latch components (e.g., 917,451, 452, 551, etc.) that help secure a target in the holding component.The latch components can be put in an engaged position and a disengagedposition. In one embodiment, holding latch 917 can rotate to adisengaged position to allow replacement target 950 to be inserted(e.g., placed, dropped, etc.) into the target cavity 911 included inholding component 910 (e.g., see FIG. 20 top illustration, etc.) andholding latch 917 can rotate to an engaged position to hold replacementtarget 950 in place (e.g., see FIG. 20 top illustration, etc.). In oneembodiment, a holding latch (e.g., 451, 551, etc.) can be put in adisengaged position to allow a replacement target to be inserted (e.g.,placed, dropped, etc.) into the holding component (e.g., see FIG. 21 topillustration, etc.) and can be put in an engaged position to holdreplacement target in place (e.g., see FIG. 21 bottom illustration,etc.). It is appreciated that a portion of a holding latch component(e.g., 551, 652, etc.) can be included in the holding component and aportion of a holding latch component (e.g., 562, 651, etc.) can beincluded in the high intensity target.

In one embodiment, a holding system can include a sensor (e.g., 370,430, 530, 630, etc.) that senses the location of high intensity target350. A sensor can have various configurations. In one exemplaryimplementation, a high intensity target collides with a sensor and asensor senses forces/pressures from the collision. A sensor can be alight/laser sensor that senses the location of a high intensity target.

With reference back to FIG. 20 , in one embodiment support lip 912 canact as a support/brace to support high intensity target 950 while stillforming an opening/window 988. In one embodiment, support lip 912 can bemoved/retracted allowing the high intensity target 950 to fall through.Alternatively, instead of support lip 912, the holding component 910 caninclude another or second holding latch (not shown) similar to holdinglatch 917 but on the opposite side of holding component. The secondholding latch can be rotated to a first position that provides supportfor or holds the high intensity target 950 or second position thatallows high intensity target 950 to fall through target cavity 911. Inone embodiment, high intensity target 950 includes a handling aid (e.g.,handle, tab, etc.) that aids insertion/ejection of high intensity target950 to and from the holding system 900.

In one exemplary implementation, portions of holding latch component 551and sensor 530 are incorporated in holding component 511. It isappreciated a high intensity target can include features that assist aholding latch component. In one embodiment, high intensity target 550includes a cavity 552 to receive the pin or bolt portion of holdinglatch component 551. Holding system 500 loading and unloading activitiescan be effectively and efficiently executed. In one exemplaryimplementation, high intensity target 550 is inserted/ejected quickly(e.g., under 30 minutes, under 5 minutes, under 1 minute, etc.).

In one embodiment, a target loading system can include an operationallocation access system. The operational location access system can allowaccess to the accelerator system to insert/eject a high intensitytarget. There can be various access component configurations (e.g., adoor, a drawer, etc.). In one exemplary implementation, accessing anoperational location involves a simple motion (e.g., opening a door,opening a drawer, etc.). In one embodiment, completing access activitiescan also include an opposite motion (e.g., closing/shutting a door,closing a drawer, etc.). Access systems can include various accesscomponents and access latches. The access components can allow andrestrict high intensity target entrance to and egress from anaccelerator enclosure via an access portal (e.g., opening, slot, gap,etc.). The access latches can assist preventing un-intended accessand/or entrance/egress. The access latches can include a quick releasetype component or action to engage/release the access component (e.g., aclasp, clip, snap, latch, bolt, hook and loop fabric strip, door knob,handle, magnetic, hook/loop, lever action, tensioner, detent, etc.). Anaccess system loading and unloading activities can be effectively andefficiently executed. In one exemplary implementation, an access systemcan enable a high intensity target to be loaded or unloaded quickly(e.g., under 30 minutes, under 5 minutes, under 1 minute, etc.).

In one embodiment, a loading system has both an access system and aholding system. The access system allows access to a high intensitytarget operational location (e.g., within an accelerator system, etc.)to insert/eject a high intensity target and the holding system preventsun-intended movement of the high intensity target while in theoperational location. In one exemplary implementation, the holdingsystem can allow high intensity target movement to different positionswithin the target operational location (e.g., to change/move theelectron beam impact location, etc.).

In one embodiment, an accelerator enclosure includes different types ofaccess components. In one exemplary implementation, an acceleratorenclosure includes an operational access component and an assemblyaccess component. The operational access component is primarily intendedfor utilization in normal operation activities, including the normalreplacement of a high intensity target. The assembly access component isprimarily intended for utilization in general non-normal operations(e.g., general repair, maintenance, etc.). The general non-normaloperations can include relatively rare/infrequent disassembly/assemblyoperations compared to operational access associated with normal highintensity target injection/ejection. In one embodiment, while a targetcould be loaded/unloaded via an assembly access component, the assemblyaccess component is primarily intended for repairing/maintainingcomponents (e.g., charged particle generation component, chargedparticle acceleration component, etc.) other than a high intensitytarget itself. While the assembly access component is not used primarilyfor allowing access to a target itself, an assembly access component canbe the primary access to loading system components in an acceleratorenclosure (e.g., for repair/maintenance of the loading component ratherthan injection/ejection of a target, etc.). In one exemplaryimplementation, an accelerator enclosure assembly access component canbe utilized to clear a jammed/stuck high intensity target (e.g., a highintensity target that an operational access component cannotinject/eject, etc.).

In one embodiment, an operational access component enables access to anaccelerator enclosure faster than an assembly access component. Theoperational access component can allow injection/ejection of a highintensity target in an accelerator enclosure faster than an assemblyaccess component can place/remove a high intensity target in theaccelerator enclosure. It is appreciated this detailed descriptionrefers to an access component as a shortened version of referencing anoperational access component.

FIG. 23 is block diagram of an exemplary multiple access system 2000 inaccordance with one embodiment. The illustrations in the upper portionof FIG. 23 show the exemplary accelerator enclosure access system 2020in general. Accelerator enclosure access system 2020 includes accesscomponent 2022, access portal 2023, and access latching component 2024.In one embodiment, the insertion and ejection of a high intensity targetvia access system 2020 involves simple/quick activities. The accesscomponent 2022 is operated (e.g., opened, slid, pulled, activated,engaged, etc.) to allow access to the accelerator enclosure 2010 viaaccess portal 783. In one embodiment, access component 2010 is a doorslid in a first direction on door rail 784.

The illustration in the lower portion of FIG. 23 shows the exemplaryaccelerator enclosure access system 2020 included in a multiple accesssystem 2000 in accordance with one embodiment. High intensity target2090 is injected/inserted into accelerator enclosure 2010 via the accessportal 2023 (e.g., slot, opening, etc.). In one exemplaryimplementation, high intensity target 2090 is injected/inserted into atarget holding system 2033. When high intensity target 2090 is insertedto the proper operational location, the access component 2022 door isslid in a second direction to close the access component 2022. When theaccess component 2022 is in the proper access denial position, theaccess latching component 2024 is operated (e.g., engaged, activated,etc.). The access latch 2024 can assist preventing un-intended operationof the access component 2024. In one exemplary implementation, anaccelerator enclosure access system can enable access to an acceleratorenclosure in under 30 minutes. When the replacement high intensitytarget 2090 is in the proper operational location, the particle source2031 can generate charged particles that are accelerated by accelerationportion 2032 towards the high intensity target 2090. When the radiationgeneration is finished, the access component 2022 can be opened and thehigh intensity target 2090 is removed/ejected from the acceleratorenclosure. An accelerator enclosure access system loading and unloadingactivities can be effectively and efficiently executed. In one exemplaryimplementation, high intensity target 2090 is inserted/ejected quickly(e.g., under 30 minutes, under 5 minutes, under 1 minute, etc.).

With reference still to FIG. 23 , accelerator enclosure 2010 alsoincludes assembly plate 2015 in addition to access component 2022.Accelerator enclosure 2010 includes particle source 2031, accelerationportion 2032, and holding component 2033. Access component 2022 is partof an effective and efficient access system that allows quick andconvenient injection and ejection of removable high intensive target2090 to and from accelerator enclosure 2010. Assembly plate 2015involves significantly more effort to gain access including looseningmultiple screws/bots 2017. Assembly plate 2015 allows general access tomultiple components (e.g., particle source 2031, acceleration portion2032, holding component 2033, etc.) in the accelerator enclosure 2010.

In one embodiment, normal replacement high intensity target loadingsystem activities are conducted via access component 2022 and assemblyplate 2015 is utilized primarily as a backup access in specialsituations (e.g., emergency requiring more access then access component,access component 2012 is broken, etc.) or for general maintenance. Inone embodiment, assembly plate 2015 can also allow emergency ormaintenance access to inject and eject high intensity target 2090. Inone exemplary implementation, assembly plate 2015 can be utilized toinject and eject high intensity target 2090 if something goes wrong withthe loading system (e.g., access component 2022, holding component 2033,etc.).

FIG. 24 is block diagram of an exemplary traditional system 2001 inaccordance with one embodiment. Traditional system 2001 is limited to asingle access via assembly plate 2005. Traditional system 2010 includesaccelerator enclosure 2002 and assembly plate 2005. Acceleratorenclosure 2002 includes particle source 2091, acceleration tube 2092,and fixed target 2093. The access to accelerator enclosure 2002 iscomplicated and ridged access. Assembly plate 2005 involvessignificantly more effort to gain access to the fixed target 2093including loosening multiple screws/bolts 2007.

Assembling and disassembling fixed target 2093 also involves significanteffort and energy. A traditional fixed target is typically configured toresist movement and separation and therefore disassembling/removing anold traditional target and assembling/attaching a different traditionaltarget can be the opposite of easy and simple. In one embodiment, fixedtarget 2093 is attached in the accelerator enclosure 2011 with multiplescrews/bolts (not shown). In one embodiment, the restricted space andlimited operating area within accelerator enclosure 2002 makesmanipulating multiple fixed fastener screws very difficult. Given thatremoval of assembly plate 2015 enables access to more (e.g., particlesource 2091, acceleration tube 2092, etc.) than just fixed target 2093,actions to remove fixed target 2093 from within the accelerationenclosure are much more complex with potential for much greaterproblems/accidents than the easy and convenient access component.

FIG. 25 is a block diagram of an exemplary accelerator enclosure accesssystem 800 in accordance with one embodiment. Accelerator enclosureaccess system 800 includes an access/holding component 872, accessportal 873, and access latching component 874. In one embodiment, theinsertion and ejection of a high intensity target 850 via access system800 involves simple/quick activities. The access/holding component 872is operated (e.g., opened, slid, pulled, activated, engaged, etc.) toallows access to the accelerator enclosure 805 system via access portal873. The access/holding component 872 can also act as a holdingcomponent that holds or restricts high intensity target 850 fromun-intended movement. In one embodiment, access component/holdingcomponent 872 is a drawer that is slid in a first direction to beexposed outside the accelerator enclosure 805. Removable high intensitytarget 850 is injected/inserted into access/holding component 872. Thenthe access/holding component 872 is slid in a second direction to beinjected inside the accelerator enclosure 805. When the access component872 is in the proper closed position, the access latching component 874can be operated (e.g., engaged, activated, etc.). The access latchingcomponent 874 can assist in securing the access access/holding component872. The access latching component 874 can include a simple/quickrelease type component or action to engage/release the access component.

When the replacement high intensity target 850 is in the properposition, the particle source 811 can generate charged particles thatare accelerated by acceleration portion 812 towards the high intensitytarget 850. The high intensity target 850 can generate Bremsstrahlungradiation in response to impacts by the charged particles. In oneembodiment, the access/holding component 872 can include opening888/(e.g., similar to opening 381,382 in FIG. 19 , etc.). The radiation(e.g., x-rays, photons, etc.) provided by high intensity target 850 canleave the access/holding component 872 via the opening/window 888 andproceed towards leaving the accelerator enclosure 805. In one exemplaryimplementation, the accelerator enclosure can also include anaccelerator enclosure opening 807 which the radiation travels throughwhen leaving the accelerator enclosure 805. When the radiationgeneration is finished, the access/holding component 872 can beopened/withdrawn from the accelerator enclosure 805 and the replacementhigh intensity target 850 removed/ejected from the acceleratorenclosure. Accelerator enclosure access system 800 loading and unloadingactivities can be effectively and efficiently executed. In one exemplaryimplementation, high intensity target 850 is inserted/ejected quickly(e.g., under 30 minutes, under 5 minutes, under 1 minute, etc.). In oneembodiment, the loading and unloading activities time duration does notinclude the time duration of generating Bremsstrahlung radiation.

It is appreciated that holding systems, access systems, and combinationsof both can be implemented in various configurations with variouscomponents. FIG. 26A includes a block diagram of an exemplary door typeconfiguration access/holding system and method in accordance with oneembodiment. Door type configuration 1010 includes acceleration enclosure1011, access portal 1014, access component/holding component 1012 (e.g.,a door, etc.), access component hinge 1019, and access latch component1017. FIG. 26B includes a block diagram of another exemplary door typeconfiguration access/holding system and method in accordance with oneembodiment. Door type configuration 1020 includes accelerator enclosure1021, access portal 1024, access/holding component 1022 (e.g., a door),and access latch components 1027 and 1029. A door type access can beimplemented on a top, bottom, or other side of a radiation chamber.

In one embodiment, the insertion and ejection of a high intensity targetvia access systems 1010 and 1020 involves simple/quick activities. Inone exemplary implementation, an access latching component (e.g., 1017,1027, etc.) can be put in a first configuration (disengaged, opened,etc.) that allows the access/holding component (1012, 1022) to open andallow access to accelerator component (e.g., 1011, 1021, etc.) via anaccess portal (e.g., 1014, 1024, etc.) Access/holding component 1012 canrotate on hinge 1016 and access component 10122 to be moved away. In oneembodiment, a removable high intensity target can be insertedinto/ejected from an operational location (e.g., within an acceleratorenclosure 1011, 1021, etc.). In one exemplary implementation, a highintensity target can be directly inserted into the operational location.In another exemplary implementation, a removable high intensity target1050 can be placed on an access/holding component (e.g., 1012, 1022,etc.) and then inserted into the operational location (e.g., withinaccelerator enclosure 1011, etc.). The access/holding component (e.g.,1012, 1022, etc.) can be put in a closed position denying/restrictingaccess to an operational location and an access latching component(e.g., 1017, 1525A, 1525B, etc.) can be put in a second configuration(e.g., engaged, close, etc.) that restricts the access component (e.g.,1012, 1022, etc.) from unintended opening.

Access system (e.g., 1010, 1020, etc.) loading and unloading activitiescan be effectively and efficiently executed. In one exemplaryimplementation, a high intensity target is inserted/ejected quickly viaconfigurations 1010 and 1020 (e.g., under 30 minutes, under 5 minutes,under 1 minute, etc.). In one embodiment, latch lock systems can beincluded in systems similar to the door type configurations in FIGS. 26Aand B. A latch key component (e.g., 1015, 1025A, 1025B, etc.) can beused to lock and restrict/prevent a latch component (e.g., 1017, 1027,1029, etc.) from being opened, and can be used to unlock and allow thelock latch component to be open.

It is appreciated that hold latches and access latches can be compatiblewith various types of latching approaches. The latch activities can beeffectively and efficiently executed. The latching activities caninclude simple/quick activity/action. In one embodiment, a latch can beconfigured as a clasp latch, draw latch, cam latch, draw or togglelatch, spring latch, Norfolk latch, Suffolk latch, crossbar latch, andso on. In one embodiment, the hold latches and access latches canlatch/unlatch (e.g., close, open, engage/disengage, etc.) in response toa single action/motion. In one embodiment, the hold latches and accesslatches can latch/unlatch (engage/disengage) in response to twoactions/motions. In one exemplary implementation, a latch/unlatch(engage/disengage) takes less than 5 minutes. In one exemplaryimplementation, a latch/unlatch (engage/disengage) takes less than 15seconds. In one embodiment, the durations are indicative of times ofactivities directly associated with executing latch activity (e.g.,closing/engaging, opening/disengaging the latch, etc.). In one exemplaryimplementation, the durations do not include additional time for otheractivities (e.g., transporting/bringing the cartridge from a remotelocation, another room, storage location, another facility, etc.) to theradiation system.

FIG. 27A is a block diagram of an exemplary latching component 1110 inaccordance with one embodiment. Latching component 1110 includeslatching component portions 1117 and 1115. Latching component portion1117 can include a hinge 1119. In one exemplary implementation, thelatching component 1110 is considered similar to a cabin latch. Theillustration on the left in FIG. 27A shows latching component 1110engaged and illustration on the right shows latching component 1110disengaged.

FIG. 27B is a block diagram of an exemplary latching component 1120 inaccordance with one embodiment. Latching component 1120 includeslatching component portions 1127 and 1125. In one exemplaryimplementation, the latching component 1120 can be considered similar toa clasp latch, draw latch, toggle latch, and so on. Latching componentportion 1127 can include a tap or handle. The illustration on the leftin FIG. 27B shows latching component 1120 engaged and illustration onthe right shows latching component 1120 disengaged.

FIG. 28 is a block diagram of an exemplary latching component 1210 inaccordance with one embodiment. The latching component 1210 includeslatching component portion 1217, latching component portion 1215, andbolt component 1219. In one embodiment, latching component 1210 isconsidered a bolt latch. Bolt component 1219 can be slid in a firstdirection to be disengaged (top illustration of FIG. 28 ) with latchingcomponent 1215 and latching component 1217 and in the opposite directionto be engaged (bottom illustration of FIG. 28 . When engaged latchingcomponent portion 1215 is effectively secured to latching component 1217and when disengaged latching component portion 1215 can be separatedfrom the latching component portion 1217. In one exemplaryimplementation, latch component 1210 can include an optional bolt lockportion that prevents unintended movement of the bolt (bottomillustration) or allows movement of the bolt (top illustration).

FIG. 29 is a block diagram of an exemplary latching component 1310 inaccordance with one embodiment. The latching component 1310 includeslatching component portion 1325 and latching component portion 1321. Thetop illustration is a side view showing an unlatched or openconfiguration in which latching component portion 1325 and latchingcomponent portion 1321 are disengaged and separated. The middleillustration is a side view showing a latched or closed configuration inwhich latching component portion 1325 and latching component portion1321 are engaged and coupled together. The bottom left illustration is atop view showing the latching component portion 1325 inserted into theopening/slot of latching component portion 1321. The bottom rightillustration is a top view showing the latching component portion 1325rotated (e.g., 90 degrees, 45 degrees, etc.) to engage/couple with thelatching component portion 1321 in an engaged/closed configuration. Inone embodiment, latch component 1310 is considered a turn lock clasplatch. In one exemplary implementation, latching component portion 1325is the turn latch portion and latching component portion 1321 is theclasp portion. In one exemplary implementation, a turn lock latch isslid in one direction and then rotated to complete thelatching/unlatching in a single action.

In one embodiment, a tool can be utilized to perform various activitiesassociated with loading and unloading a high intensity target to/from anaccelerator system. In one exemplary embodiment, a tool is considered aspecial tool and intended to be unique or dedicated to those activitiesand not intended for general or other use. In one exemplaryimplementation, a tool is associated with/utilized for latch operations(e.g., engage/close, disengage/open, etc.). In one embodiment, the toolcan act as a key that locks/unlocks a latch.

In one embodiment a special tool can be utilized in latching activities(e.g., opening a latch, closing a latch, etc.). In one exemplaryimplementation, a special tool has a particular configuration. It isappreciated various special tools and approaches are compatible withloading and unloading activities associated with a high intensitytarget. The special tool can be considered dedicated primarily for usewith a latching component, as opposed to a general tool than can havemultiple general uses. Additional discussion on use of a general toolconfiguration is set forth in other portions of this specification.Utilizing a special tool for latching can involve simple/quickactivities. In one exemplary implementation, the special tool has anuncommon/distinctive configuration that engages with (e.g., matches,mates, selectively couples to, activates, etc.) a latching component.Operation of the latch can be limited to coordination with and use ofthe special tool. In one embodiment, a latch can be located in acordoned off area/location and operation of the latch can be limited tocoordination with and use of the special tool. Possession/use of thespecial tool can be restricted to particular users (e.g., qualifiedusers, authorized users, etc.). Special tool user restrictions canpromote considerations beyond (e.g., proper use, operationalreliability, regulations compliance, etc.) direct latching functions.

FIG. 30 is a block diagram of a loading system tool system 1420 inaccordance with an embodiment. In one exemplary implementation, theloading system tool 1480 has a head configuration that matches/mateswith a latching component 1410. In one exemplary implementation, thelatching component 1410 is similar to a turn lock clasp or latchingcomponent 1310. Latching component 1410 can be enclosed with just a toolaccess portal 1435 that allows for coordination and use of the tool 1480to operate the latching component 1410.

In one embodiment, a latch can include a lock feature thatallows/prevents engagement and disengagement of the latch component. Inone exemplary implementation, a key can be used to lock/unlock the latchcomponent. The lock and key can be used to (e.g., provide security,restrict unauthorized activity, reduce improper replacement of a highintensity target, etc.). Utilizing a latch lock and key can involvesimple/quick activities. It is appreciated various lock components andapproaches are compatible with loading and unloading activitiesassociated with a high intensity target. The key can be a mechanicalkey, a digital key, biometric key, and so on. The lock can includestatus indication features that indicate the status of the lock (e.g.,locked, unlocked, attempted locking/unlocking action, tampering, etc.).The status can be indicated locally and remotely. The status can triggeralarms/warmings local and remotely. A key can be unique to a particularradiation system or group of radiation systems (e.g., model/models ofradiation system, an organization, a medical treatment facility, etc.).

In one embodiment, a latching component and latch lock can beeffectively and efficiently used. In one exemplary implementation, alatching component and latch lock can be used to latch/unlatch alatching component quickly and easily (e.g., under 30 minutes, under 5minutes, under 1 minute, etc.).

It is appreciated that features and components of high intensity targetsystems and methods may be shown in a particular orientation, thefeatures and components can also be implemented in other configurations.In one embodiment, access, holding, and latching components may be shown(e.g., FIGS. 19-34 , etc.) in a first orientation (e.g., vertical etc.),and the access, holding, and latching components can also be implementedin a second orientation (e.g., horizontal, etc.).

Operational location access components and target holding components caninclude components/features that assist with a high intensity targetinserting and ejecting activity. In one exemplary implementation,assisting with an inserting and ejecting activity of a high intensitytarget includes supplying assistance (e.g., force, energy, power etc.)to accomplish the insertion or ejection of a high intensity targetto/from an operational location.

FIG. 31 is a block diagram of an exemplary target injection/ejectionsystem 1600 in accordance with one embodiment. Target injection/ejectionsystem 1600 includes holding component 1610 and access component 1630.Access component 1630 is configured to allow/restrict access toaccelerator enclosure 1605. In one embodiment, access component 1630 isin a horizontal orientation and operates similar to access component2020 in FIG. 23 . In one embodiment, blocking component 1621, and springplate 1625 are considered part of holding component 1610. When theaccess component 1630 is open a high intensity target 1650 can beinserted to/ejected from holding component 1610. The top illustrationshows the target 1650 outside of and ejected from the acceleratorenclosure 1605. When the blocking component 1621 is engaged/activated(e.g., by lever 1627, etc.) it prevents/restricts the target 1650movement (e.g., insertion, ejection, unintended movement) and when theblocking component 1621 is disengaged/deactivated it allows the target1650 movement. Blocking component 1621 can be engaged/disengaged byvarious mechanisms (e.g., a lever, a button, a special tool, key, etc.).To insert the target 1650, the access component 1630 is engaged/opened,the blocking component 1621 is disengaged, target 1650 is pressed upagainst the spring plate 1623, which in turn allows the target to moveover the floor 1622 while compressing the spring 1625 at the same time.The floor 1622 can have a window/opening similar to the window/opening911 in holding component 910 (shown in FIG. 20 ). When the target 1650is in the proper location blocking component 1621 is engagedpreventing/restricting improper movement of target 1650 and the accesscomponent 1630 is shut. The bottom illustration in FIG. 31 shows thetarget in a proper position inside the accelerator enclosure forradiation generation. To eject the target 1650, the access component1630 is opened, the blocking component is disengaged/released and thespring associated with spring plate 1625 expands forcing the target 1650out through the access component 1630. In one exemplary implementation,spring plate 1625 assists with an ejection, including supplyingassistance (e.g., force, energy, power etc.) to accomplish the ejectionof high intensity target 1625 from accelerator enclosure 1605.

In one embodiment, a tool can be used to assist with an inserting andejecting action of a high intensity target. In one exemplaryimplementation, assisting with an inserting and ejecting action of ahigh intensity target includes supplying assistance (e.g., force,energy, power etc.) to accomplish the insertion or ejection of a targetfrom a radiation system/chamber.

FIG. 32 is a block diagram of an exemplary loading system in accordancewith an embodiment. The loading system includes access component 1737,access component 1739, holding component 1738, inert/eject mechanism1732, tool 1733, and display indicator/alarm 1770. The loading systemfeatures help/assist with injecting and ejecting a high intensity target1735 in and out of accelerator chamber 1731. In the top illustration,the tool 1733 and holding component 1738 are shown outside theaccelerator enclosure 1731. High intensity target 1735 is put in holdingcomponent 1738. In the middle illustration, access component 1739 isopened and the tool 1733 is manipulated to engage the inert/ejectmechanism 1732. A force 1751 is applied to the tool 1733 causing highintensity target 1735 to be inserted in the accelerator enclosure 1731and placed in an operational location. Tool 1733 can be removed fromaccelerator enclosure 1731, access component 1737 closed, and aradiation treatment operation performed. In one embodiment, there isalso a target control/movement system (e.g., similar to 119, 3100, etc.)configured to change positions of high intensity target 1735 within theoperational location (e.g., causing an electron beam impact location onhigh intensity target 1735 to change, etc.). Insert/eject mechanism 1732can be part of the target control/movement system. In the bottomillustration, access component 1737 is opened and another force 1752 isapplied to the tool 1733 resulting in high intensity target 1735 beingejected from the accelerator enclosure 1731. Display indicator/alarm1770 can convey information regarding the loading system status andoperations, including indicating if there are issues. It is appreciatedvarious different tools can be utilized (e.g., general/standard tool,special tool, a key, etc.).

FIG. 33 is a block diagram of an exemplary loading system in accordancewith an embodiment. The target loading system includes access component1717, holding component 1718, inert/eject mechanism 1712, insert/ejectmotor 1714 with activation button 1713, and display indicator 1719. Theloading system features help/assist with injecting and ejecting a highintensity target 1725. In the top illustration, access component 1717 isopened and high intensity target 1715 is put in holding component 1718.Activation button 1713 is manipulated (e.g., pushed, rotated, etc.) andinsert/eject motor 1714 is activated. In one embodiment, activationbutton 1713 acts as a lock and a key is required to manipulate button1713. Insert/eject motor 1714 applies forces to insert/eject mechanism1712 which moves high intensity target 1715 into/out of an operationallocation within accelerator enclosure 1711. In one embodiment,insert/eject mechanism 1712 can also be a part of a targetcontrol/movement system (e.g., similar to 119, 3100, etc.) configured tochange positions of high intensity target 1715 within the operationallocation (e.g., causing an electron beam impact location on highintensity target 1715 to change, etc.). Display indicator/alarm 1770 canconvey information regarding the loading system status and operations,including indicating if there are issues (e.g., initiating an alarm,etc.).

In one embodiment, a loading system can be used to load/unload a highintensity target (e.g., 1715, 1735, etc.) into/out of an acceleratorenclosure (e.g., 1711, 1731, etc.) quickly and easily (e.g., under 30minutes, under 5 minutes, under 1 minute, etc.).

In one embodiment, a loading system includes features to avoid/preventunintended radiation leakage. In one exemplary implementation, an accesscomponent includes features that mitigate unintended radiation leakage.In one embodiment, a various sealing configurations help preventunintended radiation leakage.

FIG. 34 is block diagram of access component sealing systems inaccordance with one embodiment. Sealing system 1810 includes a sealcomponent 1815 that gets compressed (shown in illustration on the right)by side walls 1811 and 1812. Sealing system 1820 includes aconfiguration in which seal component 1825 fits in (shown onillustrations on the right) seal component 1821. In one embodiment, aspecial configuration feature 1827 (shown as 1827A and 1727B) can beincluded in the seal components to enhance sealing characteristics.Sealing system 1850 can be integrated into an access component. Accesscomponent 1851 moves up and down by applying force to lever 1853 toopen/close accelerator enclosure portal 1855. When in the up position,seal component 1852 engages with seal component 1857 (shown inillustration on the right). In one embodiment, the system includes asafety feature alarm that indicates if the accelerator enclosure issealed properly.

It is appreciated that a proper position for a high intensity target canbe relative to radiation activities. In one embodiment a proper positionis in an operational location during radiation generation and animproper position is out an operational location (e.g., if a user forgotto insert a high intensity target, etc.). In one exemplaryimplementation, a proper position can be outside the operationallocation before and after radiation generation.

In one embodiment, a multi-access radiation camber has more than oneaccess portal. In one exemplary implementation, there are more than onetype of access portals. In one exemplary implementation, there can bemultiple access components/approaches. In one embodiment, one of theaccess components can be considered an operational access versus adisassembling access. In one exemplary implementation, there can bemultiple operational access components/portals and one disassemblingaccess. In one embodiment, operational location access is createdwithout separating/decoupling components that form the acceleratorenclosure. In one exemplary implementation, operational location accessis achieved without separating/decoupling components other than a highintensity target (e.g., there is no contiguous coupling/connectionbetween one part of an accelerator enclosure and another part that isloose/removed to gain access as in a disassembly access).

FIG. 35 is a block diagram of an exemplary multiple access radiationsystem 1900 in accordance with one embodiment. Multiple access radiationsystem 1900 includes accelerator enclosure 1907, access component 1935,and access component 1937. In one embodiment, a high intensity targetcan be inserted when component 1935 is open and ejected when accesscomponent 1937 is open or vice versa.

Consumable High Intensity Target and Cartridge

In one embodiment, multiple high intensity targets are loaded in theradiation system at the same time. In one exemplary implementation, themultiple high intensity targets are loaded in a magazine/cartridge. Themultiple high intensity targets can be loaded in the magazine/cartridgewhile the magazine/cartridge is coupled/attached to the radiationsystem. The multiple high intensity targets can be loaded in themagazine/cartridge while the magazine/cartridge is decoupled/detachedfrom the radiation system and then the loaded magazine/cartridge iscoupled to the radiation system. The multiple high intensity targets canbe individually fed into an operational location. In one embodiment, themultiple high intensity targets can be individually inserted/ejected toand from an operational location.

FIG. 36 is a block diagram of exemplary magazine/cartridge loadingsystems in accordance with an embodiment. The top illustration shows amagazine/cartridge loading system where the target magazine 2119 iscoupled to the accelerator enclosure 2101. In one embodiment, targetmagazine 2119 is permanently coupled to accelerator enclosure 2101. Inone embodiment, target magazine 2119 is removably coupled to acceleratorenclosure 2101. Multiple high intensity targets 2112, 2113, and 2114 canbe put in target magazine 2119 substantially at the same time (e.g.,loaded/dropped in the magazine one after another, etc.). Then accesscomponent 2115 can be engaged/opened to allow the high intensity target2112 to be inserted in the accelerator enclosure 2101 and held in aproper position (e.g., radiation generation) by holding component 2107.Access component 2115 can be disengaged/closed and the radiationgeneration begun. When the radiation generation is complete, accesscomponent 2117 is engaged/opened, holding component 2107 can be releasedand the high intensity target 2155 is then ejected via the portal ofaccess component 2117.

In one embodiment, a magazine/cartridge can be replaceable in theradiation system. In one exemplary implementation, a magazine/cartridgeis loaded with high intensity targets before the magazine/cartridge iscoupled to the radiation system.

FIG. 37 is a block diagram of high intensity target system 3000B inaccordance with one embodiment. High intensity target system 3000B issimilar to high intensity target system 3000A in FIG. 15 , except thehigh intensity targets are fed into the accelerator system from a targetcartridge 3030. In one embodiment, target cartridge 3030 is removablycouped to acceleration enclosure 3005. In one exemplary implementation,latching component 3080 is utilized to hold or release the coupling oftarget cartridge 3030 to/from acceleration enclosure 3005. In oneembodiment, high intensity target system 3000B can include a highintensity target cartridge 3030 for storing and loading high intensitytargets 3041, 3042, 3043 and 3044. In one exemplary implementation, theloading from high intensity target cartridge 3030 to target locationcontrol component 3010 is automatic. High intensity target system 3000Bcan include various configurations that assist the loading process. Inone exemplary implementation, high intensity target cartridge 3030includes raising component 3070 (e.g., spring, pneumatic, etc.) forforcing high intensity targets up. Structural portions of cartridgecomponent 3030 can be configured (e.g., configuration 3031, etc.) forforcing the high intensity targets out of the cartridge component 3030as the high intensity target is raised. High intensity target cartridge3030 can also include a mechanism 3032 that forces the high intensitytargets out. In one exemplary implementation, the cartridge utilizes aradiation shielded configuration for storing the used disposable Xraytargets.

FIG. 38 is a block diagram of an exemplary accelerator system 2200 inaccordance with one embodiment. In one exemplary implementation,accelerator system 2200 is similar to accelerator system 110. Accesssystem 2200 includes target location control component 2210, highintensity target 2220, particle source 2251, acceleration portion 2252(e.g., drift tube, etc.), collimator 2255, waveguide 2230, and highintensity target accelerator system movement component 2240. Targetlocation control component 2210 controls adjustments/movements of highintensity target 2220. In one embodiment, target location controlcomponent 2210 can be considered a cartridge configuration includingmultiple high intensity targets that can be considered loaded/unloadedto the accelerator system as a group and inserted/ejected to and from anoperational location individually. Particle source 2251 generatesparticles that are accelerated in acceleration portion 2252 and directedto impact high intensity target 2220. The impact results in radiationrays that are directed to collimator 2255, which controls theconfiguration of the radiation rays that leave high intensity targetsystem 2200. Waveguide 2230 directs electromagnetic waves (e.g., radiofrequency waves, microwaves, etc.) into the high intensity target system2200. High intensity target accelerator system movement component 2240adjusts the orientation of the high intensity target system 2200. Targetlocation control component 2210 can direct movement of high intensitytarget 2220 in a linearly reciprocating motion and high intensity target2220 can be a disposable X-ray generating high intensity target.

FIG. 39 is a block diagram of an exemplary high intensity targetinteraction with a collimator in accordance with one embodiment. Targetlocation control component 2310 controls adjustments/movements of highintensity target 2320. Particles are directed to impact high intensitytarget 2320 and the impact results in radiation rays that are directedto collimator 2355. Collimator 2355 controls the configuration of theradiation rays. In one exemplary implementation, the target locationcontrol component 2310, high intensity target 2320, and collimator 2355are similar to the target location control component 2210, highintensity target 2220, and collimator 2255. Collimator 2355 can includeconfigurations and mechanisms to help guide and support high intensitytarget 2320. In one embodiment, high intensity target 2320 includes agroove for the high intensity target 2320 to slide in.

FIG. 40 is a block diagram of an exemplary multiple cartridge system2400 in accordance with one embodiment. The multiple cartridge system of2400 includes an accelerator enclosure 2405 and multiple cartridges 2420and 2430. Cartridge 2420 includes high intensity targets 2422 through2424 and cartridge 2430 includes high intensity targets 2431 through2433. High intensity targets from cartridge 2420 (e.g., high intensitytarget 2421, etc.) can be inserted/ejected to/from accelerator enclosure2405 and the targets from cartridge 2430 (e.g., high intensity target2431, etc.) can be inserted/ejected to/from accelerator enclosure 2405.In one embodiment, the high intensity targets can be sequentiallyinserted/ejected in the same holding component and in another embodimentsequentially injected/ejected in different holding components.

With reference still to FIG. 40 , the top illustration shows one targetfrom one of the cartridges (2420, 2430, etc.) in an operational location(e.g., within accelerator enclosure 2405, etc.). The second illustrationshows a high intensity target from another one of the cartridges (e.g.,2420, 2430, etc.) in an operational location. The third illustrationshows multiple targets from multiple cartridges in the in operationallocations at the same time. Different configurations of high intensitytargets can be added/removed to change thickness/various configurations.The different high intensity target insertion/ejection configurationscan be utilized to achieve different radiation output. The differentradiation outputs can be utilized to realize/achieve different treatment(e.g., doses/, effects, results, etc.). In some embodiments, multipledifferent high intensity targets with different configurations enablesincreased controllability and performance of radiation generation overconventional target applications (that are typically limited to onesingle target with a static configuration).

In one embodiment, a loading system includes an ejection container forcollecting the ejected high intensity targets. The container can becoupled to the accelerator enclosure. The ejection container can bereleasably coupled to the accelerator enclosure. The releasably coupledcontainer can utilize various latching mechanisms to couple thecontainer to the accelerator enclosure. The latching mechanism can bequick attach/release mechanism. The ejection container can be similarlyreleasably coupled to the accelerator enclosure.

The ejection container can include a variety of safety measures. In oneembodiment, the ejection container includes sealing mechanisms (e.g.,prevent radiation leaks/contamination, medical related dangers (e.g.,including spread of infections, germs, virus, bacteria, etc.)

In one embodiment, the ejection container with the ejected targets iscompatible with coupling to a post radiation processing system (e.g.,recycling equipment, target health checking/quality control equipment,etc.). In one exemplary implementation, the ejection container isreleasably coupled to the post processing equipment and used highintensity targets can be automatically fed into the post processingequipment.

With reference still to FIG. 40 , the bottom illustration shows anejection container 2470 coupled to the accelerator system instead ofCartridge 2430. High intensity targets from cartridge 2420 (e.g.,replaceable high intensity target 2422, etc.) can be inserted toaccelerator enclosure 2405. The replaceable high intensity targets canbe ejected from accelerator enclosure 2405 into ejection container 2470(e.g., high intensity target 2421, etc.). In one embodiment, after theused high intensity targets are fed into ejection container 2470, theejection container 2470 can be easily decoupled from accelerator system2405. In one exemplary implementation, after the used high intensitytargets are fed into ejection container 2470 the ejection chamber 2470can be disposed of.

The cartridge can be one of a plurality of cartridges coupled to aradiation/accelerator system. FIG. 41 is a block diagram of anotherexemplary multiple cartridge system 2500 in accordance with oneembodiment. The multiple cartridge system of 2500 includes anaccelerator enclosure 2505, a cartridge selector 2531, and multiplecartridges 2512 and 2515, and eject container 2517, all of which can becoupled/decoupled to the cartridge selector 2531. In one embodiment, thecartridge selector 2531 moves a cartridge into a position coupling withaccess component 2541. In one embodiment, the access component 2541 isengaged/opened and a high intensity target (e.g., 2551,2552, etc.) isinserted into the accelerator enclosure 2505.

The top illustration shows the cartridge selector 2531 moved into aposition in which cartridge 2512 is coupling with access component 2541and high intensity target 2551 inserted into an operational position(e.g., within accelerator enclosure 2505, etc.). The middle illustrationshows the cartridge selector 2531 moved into a position in whichcartridge 2515 is coupling with access component 2541 and high intensitytarget 2552 is inserted into an operational position (e.g., withinaccelerator enclosure 2505, etc.). The lower illustration shows thecartridge selector 2531 moved into a position in which ejectioncontainer 2517 is coupling with access component 2541 and high intensitytarget 2552 is ejected out of the operational position (e.g., withinaccelerator enclosure 2505, etc.) and into ejection container 2517.

In one embodiment, another access component can be used in additionto/instead of an assembly component to clear a jam. In one embodiment,an operational access component allows enough access room/space to reacha jammed high intensity target. In one embodiment, an additionalseparate jam release access component can be included and allow enoughaccess room/space to reach a jammed high intensity target. In oneembodiment, in addition to the normal operational access component anadditional smaller access component can be added to allow a jam clearingtool to be used. In one embodiment, the jam clearing access componentcan similar to a normal operation access component allowingquick/convenient/safe access to the operational location. In oneembodiment, a regular tool that has a primary function other thanclearing a jam can be utilized to clear the jam. In one exemplaryimplementation, a screw driver with a primary function of tightening andloosing screws can be utilized to put a misaligned high intensity targetback on a proper insert/ejection path.

In one embodiment, a loading/unloading system can include a jam clearingmechanism. The jam clearing mechanism can be utilized to inject/eject ahigh intensity target through a normal operational access when a regularinjection/ejection mechanism fails. In one embodiment, the regularinjection/ejection mechanism is automatic and the jam clearing mechanismis manual.

FIG. 42 is a flow chart of a high intensity target loading/unloadingmethod/process 2900 in accordance with one embodiment. It is appreciatedthat the operations of high intensity target loading/unloading processcan be manual or automatic.

In block 2910, a magazine/cartridge is loaded with multiple highintensity targets. The magazine/cartridge can be loaded manually. Themagazine/cartridge can be loaded automatically.

In block 2920, the cartridge, including the multiple high intensitytargets, is loaded in/coupled with an is coupled to the acceleratorsystem before the targets are loaded.

In block 2930, a cartridge selection process is performed. In oneembodiment, the cartridge is included in a plurality of cartridgescoupled to the accelerator system.

In block 2940, access to an operational location (e.g., within anaccelerator enclosure, etc.) is obtained. In one embodiment, the accessis obtained by engaging opening an access component. In one exemplaryimplementation the access is obtained automatically.

In bock 2950 a high intensity target is inserted in the operationallocation e.g., within an accelerator enclosure, etc.). In oneembodiment, the high intensity target is inserted into a holdingcomponent. The high intensity target can be inserted automatically. Inone exemplary implementation, a high intensity target is inserted from amagazine/cartridge is inserted into the operational position (e.g.,within an accelerator enclosure, etc.). The cartridge can be a cartridgeselected in cartridge selection process (e.g., in block 1030, etc.)

In block 2960, after a radiation operation is performed access to theoperational position (e.g., within an accelerator enclosure, etc.) isobtained again. In one embodiment, an access component isengaged/opened. The access component can be the same as the accesscomponent utilized in block 2940 or the access component can be adifferent access component.

In block 2970, the high intensity target is ejected from the operationallocation. The high intensity target can be ejected automatically. In oneembodiment, the high intensity target is ejected into a container. Thecontainer can be a cartridge or a different type of container. Thecontainer can be the same as the cartage the high intensity target wasloaded from.

In block 2980 the ejected high intensity target is removed from theradiation/accelerator system.

The high intensity target produces radiation in response to impact andcollision with charged particles. In one exemplary implementation ofmethod 2900, a particle impact location on the high intensity target isadjusted based in part upon heat generation resulting from the impact ofa charged particle on the high intensity target and generation of theradiation rays. Adjustments to particle impact locations on the highintensity target assist in mitigating detrimental heat conditions.

Consumables are relatively common in the medical device industry andwell accepted by customers. The target can be easily swappable, oralternatively, an automated target replacement mechanism can beimplemented. Automated quality assurance tools similar to thoseimplemented on Varian's Machine Performance Check (MPC) can be used tostreamline rapid QA after target swaps. For safety, methods likeradiofrequency identification or QR-based activation codes can be usedto ensure that only particular vendor supplied targets are used. In oneembodiment, an accelerator system includes a quality check system thatchecks proper performance of the replaceable high intensity target. Theaccelerator system can be configured to automatically monitor thecondition of the replaceable high intensity target. A replaceable highintensity target can include an identification feature. The sametechnology can be used to track usage and ensure that targets are notused past their rated exposure limit.

A high intensity target can be configured for efficiently andeffectively dissipating heat. In some embodiments, the location of heatgeneration from particle collisions and the transfer of heat from thelocation of generation can impact the configuration of the highintensity target. A high intensity target can have differentconfigurations (e.g., material, shape, contours, etc.) based uponvarying characteristics. Some portions (e.g., exterior surface, sidewall, interior layer, portion in/not in the electron beam path, etc.) ofa high intensity target can be selected/configured based on differingcharacteristics (e.g., radioactive emission characteristics, mitigatingheat conductivity characteristics, radiation resistance or blockingability to facilitate containment of radiation from undesirableemission, etc.). The differences in portion characteristics can beachieved by various approaches (e.g., different materials/substance indifferent portions of a high intensity target, different contours/shapesin different portions of a high intensity target, etc.). The portions ordifferent regions of particle impact locations can produce differentradiation/heat results based on the different configuration,composition, and characteristics of the respective regions/location. Ahigh intensity target can be moved to the different regions/positions atdifferent times to achieve different affects. The movement to thedifferent regions can be coordinated with desired results according to atreatment plan.

Additional Temperature Control Features

Variations of the high intensity target systems and methods can includean additional way to increase the peak current that can be deliveredduring each individual beam pulse. One way is to increase the spot sizeof the electron beam. Since the target operates mainly in the transientregime, active cooling is theoretically not necessary since most of thethermal energy from the beam is absorbed by the thermal capacity of thetarget rather than carried away as would be necessary for a targetoperating in steady state. In one embodiment, elimination of watercooling on the disposable part of the target enables significant costreduction of the consumable part.

In one embodiment, a high intensity target system and method can includeactive cooling features. The active cooling features (e.g., temperaturecontrol, air flow control, etc.) can be directed to assisting mitigationof heat dissipation issues. In one exemplary implementation, a highintensity target accelerator system can include air temperature/flowcontrol mechanisms (e.g., fan, colling compressor, etc.) thatcontrol/regulate ambient air in the area of a high intensity target. Theactive cooling features can be included in various parts of the highintensity target accelerator system (e.g., a high intensity targetcontrol component, cartridge component, collimator, etc.). In oneexemplary implementation, a high intensity target is pre-cooled beforeparticle collisions occur (e.g., pre-cooled in a cartridge, etc.).

Multiple Accelerator Systems and Methods

It is appreciated that the presented high intensity target systemsenable implementation of efficient and effective radiation systems. Onecharacteristic of the presented high intensity target systems is theyare generally less expensive and more cost effective than conventionalsystems. This in turn enables presented high intensity target systems toovercome the practical limitations of traditional approaches. Given theefficiency and effectiveness of high intensity target systems andovercoming conventional system limitations, it becomes practical toutilize multiple accelerator systems to further assist in overcomingdose limitations of traditional approaches. In one exemplaryimplementation, combining multiple accelerator systems and applyingsubstantially simultaneous radiation from multiple approaches/anglesenables combined greater dose rates.

In one embodiment, an average dose rate is greater than or equal to 1.0Gy/s at one meter SAD and peak dose rates greater than or equal to 0.002Gray per pulse (Gy/pulse). In one exemplary implementation, a highenergy machine can achieve a dose rate of 4,000 MU/min at 10 MeV. Thepeak target current, pulse repetition rate and average beam power ontothe target are 55 mA, 360 pps and 1 kW, respectively. In one exemplaryimplementation, a high intensity target can sustain twice the peakcurrent, and if the target moves between pulses, the pulse repetitionrate can be increased fivefold to 1,800 pps. In addition, a reduction ofthe source-axis-distance (SAD) from 1 m to 80 cm, can lead to twice thedose rate due to the 1/r² dependency of dose rate on SAD. The combinedeffect of these improvements is that an accelerator system can deliveralmost 14 Gy/s. Therefore, combining three or more accelerator systemsenables combined dose rates above the 40 Gy/s that is generallyassociated with a FLASH regime. In one embodiment, an individualaccelerator contributes Bremsstrahlung radiation corresponding toaverage dose rates greater than or equal to 2.0 greys per second (Gy/s)at isocenter to a total dose rate of Bremsstrahlung radiation from aplurality of accelerators, wherein total dose rate amount ofBremsstrahlung radiation corresponds to average dose rates greater thanor equal to 40.0 greys per second (Gy/s) at isocenter.

Thus, to further achieve better dosimetry, additional acceleratorsystems can be added. FIG. 43 shows an example of five acceleratorsystems in accordance with one embodiment. Multiple acceleratorconfiguration 4800 includes accelerator systems 4810, 4820, 4830, 4840,and 4870, support component 4895, and patient with target tissue 4899.In one exemplary implementation, accelerator systems 4810, 4820, 4830,4840, and 4870 are similar to accelerator system 110 and supportcomponent 105 is similar to support component 4895. The acceleratorsystems 4810, 4820, 4830, 4840, and 4870 can be mounted 72 degrees apartin a circular plane (e.g., on a gantry 4805, etc.). In one exemplaryimplementation, better dose profiles are expected if an odd number ofaccelerator systems are used, as no two accelerators would be colinearto retrace the same path through healthy tissue. The accelerator systemsand associated RF chains can include 10 MV energy S-Band with small bendmagnets. In one embodiment, an accelerator system can deliver 18 GY in270 ms. The use of multiple accelerator systems enables use ofcollimators with characteristics (e.g., speed, etc.) that can facilitatecost reductions compared to traditional approaches.

A system can include diagnostic imaging systems. FIG. 44(A) illustratesan exemplary configuration with five accelerator systems and 3integrated kV imaging systems in accordance with one embodiment. FIG.44A also demonstrates one potential way to balance the describedmodifications in energy per pulse, repetition rate, SAD and number ofaccelerator systems. For example, the energy per pulse can be increasedby a factor of three or the SAD can be reduced more aggressively. Beingmore aggressive at one step can further increase dose rate or enabletreatment to be less aggressive at other steps. For example, the pulserepetition rate can be reduced to 1,000 pps by using 9 acceleratorsystems instead of 5.

The gantry can be stationery and couch kicks can be used to find a setupthat minimizes conflict with critical organs. Alternately (oradditionally), the gantry can rotate (e.g., by +/−36 degrees, etc.) toprovide true 360 coverage since the configuration is angularly symmetric(e.g., at 72 degrees, etc.). In one embodiment, an optimal angle for thetreatment delivery can then be chosen. Furthermore, in one embodimentthe full allowed rotation (e.g., starting at −36 degrees and going to+36 degrees, etc.) enables a cone beam CT (e.g., 220 degree cone beam,etc.), if the images from the kV systems (e.g., three kV systems, etc.)are combined. The gantry can also traverse a rotational range (e.g., thefull range between accelerator systems, 72 degrees, etc.) rapidly (e.g.,on the order of a second. etc.) making arc therapy possible (e.g.,FLASH-Arc Therapy, FLASH-VMAT, etc.). The different orientations (e.g.,gantry rotation, robotic arm rotation, etc.) can provide flexibility fordifferent radiation entrance angles in a tissue target.

FIG. 44(B) shows an exemplary configuration with seven acceleratorsystems, in which the kV imaging system is moved onto a separate ring tomake space for additional accelerator systems. The imaging ring can bemuch lighter than the treatment gantry and therefore rotateindependently through a full or half rotation, eliminating the need forduplicate kV imaging systems. The couch can translate axially to movethe tissue target (e.g., tumor, etc.) from the imaging plane to thetreatment plane or a mechanism can be implemented that moves the imagingcomponents axially in and out of the treatment plane. In one exemplaryimplementation, a configuration with seven accelerator systems caninclude one kV imaging system on a separate gantry.

FIG. 44(C) shows an example of nine accelerator systems in a firstorientation in accordance with one embodiment. In addition to allowingfor lower pulse repetition rates, a larger number of accelerator systemscan also allow for better treatment plans. A larger number ofaccelerator systems can be particularly helpful if the treatment gantryis stationary. Eliminating the need to rotate the treatment gantry canenable reductions in cost and complexity.

FIG. 44(D) shows an example of nine accelerator systems in a secondorientation in accordance with one embodiment. In one embodiment,multiple accelerator systems can be included in a gantry system. Thegantry can be stationery and couch kicks can be used to position apatient. FIG. 44(D) shows a configuration where the 10 MeV acceleratorsystems are arranged horizontally and use a bend magnet with energyslit. Horizontal placement allows for a longer accelerator system, whichcan reduce costs of the RF system. The bend magnet with energy slit canproduce cleaner energy spectra and reduce thermal load on the x-raytarget by scraping the low energy tail. In one exemplary implementation,FIG. 44D illustrates a configuration with nine accelerator systems thatalso use bend magnets.

It is appreciated that the presented high intensity target acceleratorsystems and methods are compatible with various configurations. Highintensity target accelerator systems and methods can be implemented withvarious mounting configurations (e.g., gantry, robotic arm, etc.). FIG.45 is a block diagram of a high intensity target accelerator robotic armsystem 5000 in accordance with one embodiment. In one exemplaryimplementation, robotic arm system 5000 is a multi-beam photon flashtreatment system using robotic arms for moving accelerator systems. Highintensity target accelerator robotic arm system 5000 includes a base5010, a first arm segment 5021, second arm segment 5022, a third armsegment 5023, a first arm joint 5031, a second arm joint 5032, andaccelerator system 5050. Joints 5031 and 5032 enable arms 5022, 5022,and 5013 to move in various directions. In one exemplary implementation,the high intensity target accelerator robotic arm system 5000 allows forgreater flexibility in positioning and delivering the beams. The highintensity target accelerator robotic arm system 5000 can enable theaccelerator system 5050 to move in an vertical motion (e.g., 5071),horizontal motion (e.g., 5072), and a rotating motion (e.g., 5073).

In one embodiment, multiple robotic arms and corresponding acceleratorsystems can be utilized. FIG. 46 is a block diagram of an exampleimplementation with multiple accelerator systems mounted on multiplerobotic arms in accordance with one embodiment. In one exemplaryimplementation, the patient is resting on a 6 degree of freedom (D.O.F.)robotic couch and the accelerator systems are included in a 6independent D.O.F. robotic arm. It is appreciated various adjustmentscan be made in the robotic arms (e.g., independent motions, coordinatedmotions, etc.). In one embodiment, the accelerator systems include highintensity targets. Mounting each accelerator on a robot arm can allowfor greater flexibility in positioning and delivering the beams.

It is appreciated that high intensity target systems and methods can becompatible with a variety of radiation treatment approaches. A highintensity target can be utilized for high dose rate treatments. In oneembodiment, a high intensity target is used to deliver radiation therapycapable of relatively high dose rates that are delivered during timeintervals of frozen movement or no movement in a treatment target. Inone exemplary implementation, a radiation treatment dose rate iscompatible with delivery of radiation to a treatment target in a chestarea in a time interval corresponding to no movement in the chest areadue to inhaling or exhaling a breath (e.g., no movement due to a lungexpanding, contracting, etc.).

Some treatment or therapy approaches include ultra-high dose ratetreatment or modality referred to as FLASH radiotherapy. Therapeuticwindows associated with FLASH therapy often enable reduced normal tissuetoxicity while maintaining cancerous tissue tumor control. In oneembodiment, a high intensity target is used to deliver FLASH radiationtherapy. In one exemplary implementation, the FLASH radiotherapy doserate can be at least 40 Gray per second (Gy/s). The radiation therapysystems and methods can also be compatible with multiple field treatmentapproaches in which different fields are associated with a particulartreatment trajectory and a dose per field that is a portion or fractionof a total dose delivery. In one embodiment, getting above 1 Gy/srequires a radiation system capable of operating at greater than 1 MeV.

FIG. 47 is a graphical representation of some exemplary various aspects(e.g., configurations, functionalities, operations, conditions,features, characteristics, etc.) that are significantly different in thenew high intensity target systems and methods. The differences canenable high intensity target systems and methods to supply high doserates (e.g., greater than 40 Gy/s, FLASH, etc.) The different aspectscan include:

-   -   1) a replaceable/disposable target (e.g., a 2× dose rate        increase, etc.);    -   2) a movable target—change in electron impact location (e.g., a        5× dose rate increase, etc.):    -   3) change SAD (e.g., a 2× dose rate increase, etc.): and    -   4) multiple simultaneous accelerators (e.g., a 5× dose rate        increase, etc.).        The dose rates indicate exemplary high intensity target system        and method dose rate increases with respect to traditional        approaches (e.g., doubling, 5 times, etc.). It is appreciated        that different combinations (e.g., with different modifiers,        etc.) can be implemented. FIG. 47 is a graphical representation        illustrating progression to achieving increases in dose rates.        The dose rates are shown for existing true beam 10FFF@1KW,        increases due to doubling peak current, improvements due to        increasing the rep rate to 1.8 kHz, improvements due to recuing        SAD to less than or equal to 80 cm, and an increase associated        with using 5 high intensity target accelerator systems. In one        exemplary implementation, a high intensity target accelerator        system achieves a dose rate of 70 Gy/s. associated with FLASH        therapy dose rates using multiple 10 MeV high intensity target        accelerator systems in a multi-angle system.

In one embodiment, a radiation system can include areplaceable/disposable high intensity target. In one embodiment, aradiation system can include a movable high intensity target. Aradiation system can include both high intensity a target that is bothreplaceable/disposable and moveable. In one embodiment, a high intensitytarget is replaceable/disposable first and movable second. In oneembodiment, a high intensity target is moveable first andreplaceable/disposable second.

In one embodiment, accelerator systems can be independently powered bytheir own RF chain. Each accelerator system can include its own highintensity target, ion chamber and collimator. Some of the components canbe readily adapted for use with off-the shelf components.

FIG. 48 is a block diagram of an exemplary radiation system 5300 withmultiple accelerators in accordance with one embodiment. The radiationsystem 5300 can be configured with separate independent RF chains fedfrom a bank of RF generators. The RF source and modulator can beincluded in a bank configuration. In one embodiment, a RF generationsystem bank can be utilized to supply RF signals via the RF chains. Inone exemplary implementation, accelerator systems can be operated (e.g.,powered, tuned, servo-controlled, intensity modulated, etc.)independently by their own RF chain. In one embodiment, independentoperation of the accelerators enables different treatment results fromdifferent accelerators (e.g., different doses, different dose rates,different types of radiation, etc.).

In one embodiment, the independent operation of the accelerators can becoordinated. In one exemplary implementation, the coordination can bedirected to achieving a treatment plan. In one exemplary implementation,a first accelerator provides a first portion of a treatment planradiation and a second accelerator provides a second portion of atreatment plan radiation, and the first and second portion arecoordinated so that together they satisfy the overall treatment planradiation.

In one embodiment, an accelerator system (e.g., similar to acceleratorsystems 110, 1300, etc.) can receive microwave signals from a RF chain.In one embodiment, a RF chain includes a RF source and a modulator. A RFchain can also include a waveguide, a rotary joint, a circulator,coupled AFC and servos, and so on. FIG. 48 is a block diagram of anexemplary radiation system 5300 with multiple accelerator systems inaccordance with one embodiment. Radiation system 5300 includes amicrowave generation system 5310 and accelerator systems 5320, 5330,5340, 5350, and 5370. In one embodiment microwave generation system 5310is organized in a bank configuration comprising modulators 5311A, 5312A,5313A, 5314A, and 5315A coupled to klystrons 5311B, 5312B, 5313B, 5314B,and 5315B, respectively.

The accelerator systems 5320, 5330, 5340, 5350, and 5370 can receivemicrowave power from microwave generation system 5310 via RF chains.Accelerator systems 5320 receives microwave signals via a RF chaincomprising modulator 5313A, klystron 5313B, waveguide 5391, circulator5381, and so on. Accelerator systems 5340 receives microwave signals viaa RF chain comprising modulator 5315A, klystron 5315B, waveguide 5392,circulator 5382, and so on. Accelerator systems 5350 receives microwavesignals via a RF chain comprising modulator 5314A, klystron 5314B,waveguide 5393, circulator 5381, and so on. Accelerator systems 5370receives microwave signals via a RF chain comprising modulator 5312A,klystron 5312B, waveguide 5394, circulator 5384, and so on. Acceleratorsystems 5330 receives microwave signals via a RF chain comprisingmodulator 5311A, klystron 5311B, waveguide 5395, circulator 5385, and soon. Similar to respective RF chains having respective multi-portcirculators (e.g., 5381, 5382, 5383, 5384 5385, etc.) RF chains can haverespective rotary joints, couplers, automatic frequency/fine control(AFC), servos, and so on.

In one embodiment, accelerator systems (e.g., 5320, 5330, 5340, 5350,5370, etc.) can be similar to accelerator systems 110, 1510 and so on.In one embodiment, an accelerator system (e.g., 5320, 5350, etc.) caninclude a linear accelerator (e.g., 5321, 5351, etc.), a high intensitytarget (e.g., 5323, 5353, etc.), and a primary collimator (e.g., 5322,5352, etc.). The accelerator systems can include flattening free filterlinear accelerators. In one exemplary implementation, an acceleratorsystem (e.g., 5320, 5350, etc.) can include a secondary collimator(e.g., 5327, 5357, etc.). The secondary collimator can be a lowresolution slow multi-leaf-collimator (MLC).

In one embodiment, adding an MLC to every beam line can be costly,however high intensity target systems and methods can enableopportunities for cost reduction to be implemented and leveraged. Sincea FLASH system is primarily a radiosurgery system, the MLC can besmaller, or a cone-based collimation system can be used. The MLC can befurther cost-reduced by accepting slow leaf speeds and only moving theleaves during setup, but not during treatment. Larger (and thereforefewer) leaves can be implemented.

It is appreciated that some of the components of a high intensity targetsystem can be readily altered/changed for use with off-the shelfcomponents. While some components can be implemented byaltering/changing off the self components, other components (e.g., highintensity targets, high rep rate RF system bank, “fast” gantry, etc.)are not readily available by altering/changing off the self components.

The bank of RF generators can include multiple RF generation vacuumtubes. While some types of RF generation vacuum tubes (e.g., klystron,magnetron, etc.) may be better suited to different applications (e.g.,traditional radiation treatment, FLASH radiation treatment, etc.), it isappreciated that presented RF generation systems/schemes are compatiblewith different types of RF generation. In one embodiment, a long-lastinghigh average power klystron can be operated at an increased pulserepetition frequency (PRF). In one exemplary implementation, thelong-lasting high average power klystron can be operated at an increasedPRF at the expense of pulse length. While a Klystron may havelimitations on time averaged heat flux and pulsed heating of thecollector (e.g., energy per pulse, etc.), trading pulse length for PRFresults in similar peak power output and collector pulse heating. Thetable 2 below includes characteristics of different Klystrons (e.g.,types A, B and C) in accordance with one embodiment.

TABLE 2 Operating Peak Average RF Pulse Average Klystron Frequency RFPower RF Power Length Beam Type (GHz) (MW) (kW) (uS) Power A 2.9985 516.3 880 167 B 2.856 5.5 25 600 178 C 2.856 5 18 667 163

In one embodiment, a modulator is capable of handling a high averagepower (e.g., 50-80 kW, etc.) per vacuum tube RF generator. The selectionof the modulator and average power can depend upon an accelerator guidelength, PRF, peak RF power chosen, and so on. In one exemplaryimplementation, a modulator can operate at 500 HZ and include insulatedgate bipolar transistor (IGBT) switches (e.g., that operate at 4-5 kHz,etc.). In one exemplary implementation, a modulator can include IGBTswitches and operate at pulse frequencies between 500 Hz and 5 KHz. Themodulator or modulator bank can operate with a RF peak power of 20-50Mw, pulse voltage of 250-360 kV, pulse current of 200-350 A, a modulatorpeak of 115 MW, and a modulator average of 80 kW. In one embodiment, aPRF is extended (e.g., from 1 kHz to 1.8 kHz, etc.). In one embodiment,the independent delivered photon beam lines can have large overlaps(e.g., radiation beams from different accelerators can overlap/intersectin a tissue target volume, etc.). Radiation generation by multipleaccelerators can be coordinated to provide various radiation therapy andtreatment effects.

While the results may be similar, it is appreciated the presentedmultiple accelerator system implementations (e.g., with respective highintensity targets, etc.) can be more efficient and effective thanconventional approaches. It is also appreciated that multipleaccelerator system implementations (e.g., similar to system 500, 2000,etc.) can be flexibly configured. In one embodiment, multiple patientstations with separate patient supports and corresponding acceleratorsystems can be serviced by a single microwave generation system bank.

In one embodiment, a radiation station includes multiple accelerators(e.g., on a gantry, etc.) loaded with different high intensity targets.The high intensity targets can be different types (e.g., differentconfigurations, materials, shapes, etc.). The high intensity targets canbe associated with different treatment doses/effects. In one exemplaryimplementation, one of the accelerators is loaded with a first type oftarget (e.g., tungsten, etc.) and another accelerator loaded with asecond type of target (e.g., copper, etc.) and different treatmentdoses/effects can be achieved by using a combination of radiation fromdifferent types of targets (either simultaneously or sequentially, etc.)but having an advantage over prior art.

FIG. 49 is a block diagram of an exemplary multiple patient stationradiation system 5400 in accordance with one embodiment. Multiplepatient station radiation system 5400 includes multiple patient stations(5412, 5422, 5432, 5442, 5462, 5472, 5482, and 5492). In one embodiment,a patient station includes a patient support (e.g., similar to support105, 595, etc.) and multiple accelerator systems (e.g., similar toaccelerator systems in FIG. 1, 37, 38 , etc.). The patient stations(5412, 5422, 5432, 5442, 5462, 5472, 5482, and 5492) can be located inseparate rooms (5411, 5420, 5431, 5441, 5461, 5471, 5481, and 5491). Inone embodiment, patient stations 5412, 5422, 5432, 5442, 5462, 5472,5482, and 5492 can be located in a single room. Multiple patient stationradiation system 5400 includes a RF generation system 5452 configured tosupply RF signals (e.g., microwave, etc.) to the patient stations 5412,5422, 5432, 5442, 5462, 5472, 5482, and 5492. In one embodiment, RFgeneration system 5452 is coupled to RF chains 5414, 5424, 5434, 5443,5464, 5474, 5484, and 5494 which are coupled to the patient stations5412, 5422, 5432, 5442, 5462, 5472, 5482, and 5492, respectively. In oneexemplary implementation, waveguide 5414 supplies RF signals toaccelerators 5415, 5417, 5418, and 5419.

Multiple patient station radiation system 5400 can also include acontrol station 5455 that is communicatively coupled to other componentsof multiple patient station radiation system 5400. Control station 5455can provide direction/control of the other components, includingdirecting operations in accordance with various radiation medical plans.In one embodiment, control station 5455 is considered a central controlstation configured to control multiple patient stations (e.g., 5412,5431, 5441, etc.). Control station 5455 can provide various monitoringfeatures. The control and monitoring can include tracking and directingvarious high intensity target operations. Directing replacement regimes,receiving alarms when a target is not replaced properly, and so on. Inone embodiment, control station 5455 can include a computer system(e.g., including a processor, memory, display, input/output components,communication components, user interface, etc.). In one exemplaryimplementation, control station 5455 is similar to control system 120 inFIG. 1 .

In one embodiment, various features and capabilities can be sharedbetween the different components within a high intensity target system.In one exemplary implementation, capabilities of RF generation system5452 and control station 5455 are shared with patient stations (5412,5422, 5432, 5442, 5462, 5472, 5482, and 5492). Leveraging the controlstation and RF generation system capabilities across the multiplepatient stations can be overall less expensive and facilitate costsavings compared to a system in which control station and RF generationsystems capabilities are utilized by only one accelerator. In oneexemplary implementation, RF generation system signals are timemultiplexed to the different ones of the plurality of patient stations.In one exemplary implementation, control station capabilities can betime multiplexed to the different patient stations. In one exemplaryimplementation, control station capabilities can operate in parallelwith the different patient stations.

It is appreciated that systems can have different configurations anddifferent portions/components of a system can be shared between aplurality of stations or dedicated to a particular station. In oneembodiment, an entire microwave generation system can be shared bymultiple patient stations. In one embodiment, a first patient stationand a second patient station can be configured to share a first subsetof components included in the microwave generation system. The firstpatient station and a second patient station can be configured withrespective dedicated/unshared second subsets of components included inthe microwave generation system. The first subset of components caninclude a first type of component included in the microwave generationsystem and the second subset of component can include a second type ofcomponent included in the microwave generation system. In oneembodiment, a modulator bank is shared, but each station has their ownmicrowave source. In one exemplary implementation, a switching unit of amodulator is shared between multiple stations while pulse transformersand klystrons are dedicated to individual stations.

FIG. 50 is a block diagram of an exemplary remote resource system 5500in accordance with one embodiment. Remote resource system 5500 includeslocal facility 5502, network 5521, and remote resources 5557. Localfacility 5502 includes multiple patient stations 5572, 5582, and 5592and RF generation system 5552 in separate rooms 5571, 5581, 5591, and5551. Patient stations 5572, 5582, and 5592 are coupled to RF generationsystem (5552) via RF chains (e.g., 5584, 5594, etc.). In one embodiment,local facility 5502 is similar to multiple patient station radiationsystem 5400. In one embodiment, a patient station includes a patientsupport (e.g., similar to support 105, 595, etc.) and multipleaccelerator systems (e.g., similar to accelerator systems in FIG. 1, 38, etc.). The patient stations (5572, 5582, and 5592) can be located inseparate rooms (5571, 5581, and 5591). In one embodiment, patientstations 5572, 5582, and 5592 can be located in a single room. Room 5551includes a RF generation system 5552 configured to supply microwavesignals to the patient stations 5572, 5582, and 5592. In one embodiment,microwave generation system 5552 is coupled to RF chains 5574, 5584, and5594, which are coupled to the patient stations 5572, 5582, and 5592. Itis appreciated that a local facility can include various radiationsystem configurations (e.g., similar to radiation systems 100, 200,5300, 5400, etc.).

Multiple patient station radiation system 5500 can also include acontrol station 5555 that is communicatively coupled to other componentsof multiple patient station radiation system 5500. In one embodiment,control station 5555 can include a computer system similar to controlstation 5455. In one embodiment control station 5555 is coupled to RFgeneration system 5552 and stations 5572, 5582, and 5592. Controlstation 5555 can provide direction to/control of the other components,including directing operations in accordance with various radiationmedical plans. Control station 5555 can provide various monitoringfeatures. The control and monitoring can include tracking and directingvarious high intensity target operations. In one exemplaryimplementation, Control station 5555 operations can include directinghigh intensity target replacement regimes, receiving alarms when a highintensity target is not replaced properly, and so on. Control station5555 can utilize artificial intelligence resources, expert systems,machine learning, etc. Control station 5555 in local facility 5505(e.g., a medical facility, a specialized treatment facility, a hospital,a doctor's office, etc.) can also communicate with network 5521 andremote resources 5557 in remote location 5509 (e.g., another medicalfacility, radiation system equipment manufacture/service, high intensitytarget supplier, etc.). In one embodiment, network 5521 includes variouscloud resources that control station 5555 and remote resources 5557 canutilize and leverage.

In some embodiments, a high intensity target is compatible withprecision controllability of the radiation beam. In some embodiments, ahigh intensity target facilitates generation and control of a relativelysmall diameter or circumference radiation beam. In some embodiments,radiation generation control facilitates ultra-high radiation dose rateswith high fidelity delivery. The systems and methods can be compatiblewith pulse width modulation and timing control resolution is configuredto facilitate delivery fidelity approaching intra-pulse and micro-bunchlevels (e.g., corresponding to individual bunches per radio frequencycycle in a pulse width, etc.). The radio frequency can be in themicrowave range. The systems and methods are also compatible withmultiple field treatment approaches and can enable dose delivery foreach fraction/field to be effectively controlled. In one embodiment, ahigh intensity target system can be implemented in systems running atbeam power levels greater than 1.5 kW.

Thus, the presented systems and methods facilitate efficient andeffective radiation beam generation. In some embodiments, a highintensity target system and method enables improved performance athigher energy levels over limited traditional Xray target approaches.The configuration of a high intensity target and adjustment of particleimpact locations enables changes and improvements over conventionalapproaches, including operating at higher energy, dissipating great heatemission, and so on. In some embodiments, X-ray fluences can beincreased by at least an order of magnitude over conventional levels. Insome embodiments, a radiation system including a high intensity targetproduces intrinsic beam fluences with comparable or better spectralquality as those produced by a conventional Xray target. A highintensity target configuration can also facilitate better resolution anddecreased treatment spot sizes. In some embodiments, a radiation systemcomprising a high intensity target configuration facilitates small focalspots for new and current treatments. The high intensity target systemconfiguration can facilitate sharper edge definition during treatment.

It is appreciated that high intensity target configurations can beutilized in applications other than medical radiation applications. Insome embodiments, high intensity target configurations can be utilizedin various applications (e.g., medical, industrial, security, etc.). Thehigh intensity target configuration can facilitate improved (e.g.,faster, better image resolution, etc.) scanning of enclosed containers(e.g., packages, baggage, cargo scanning, etc.)

In one embodiment, a high intensity target approach is based on heattransmission characteristics, unlike conventional approaches.Conventional improvements to a solid Xray target are usually difficultto employ and do not typically offer much improvement in heatdissipation. While some traditional approaches may include a movingtarget that is not readily replaceable (e.g., Xray tube targets, etc.),the movement and characteristics of the target are not sufficient todisseminate heat at rates used in FLASH treatments. In addition, use ofrotating targets in traditional diagnostics (e.g., Xray tubes targets,targets that are angled with X-rays emitted out an orthogonal side,particles impact and X-rays emitted from same side of the target, etc.)are very different from high energy targets used for treatment therapy(e.g., transmission target, particles impact one side of the targetmaterial and X-rays are emitted from an opposite side of the targetmaterial, etc.) Traditional approaches using free flowing liquid Xrayjet streams can result in reduced and inconsistent radiation generation.

Presented high intensity target systems and methods can help overcomebarriers for developing photon flash treatments, including limitationson dose delivery capabilities of conventional photon radiotherapysystems. High intensity target system dose delivery is considerablyimproved and allows for Flash treatments. Overcoming conventionalbarriers enables realization of multiple and significant advantagesassociated with x-ray photons. Photons can reach deep seated tumors atfar lower energies than are required for electrons and ions (e.g., <10MeV for photons vs >>100 MeV for electrons and ions, etc.). Photons canbe emitted almost isotopically. In one embodiment, no raster scanning isneeded. In one exemplary implementation, a 10 MeV Photon Flash systemcan fit into existing bunkers. In one embodiment, a high intensitytarget system can use mostly off-the shelf commercially availablecomponents. In one embodiment, a high intensity target system isconsiderably more economically than conventional systems. Significantly,x-ray sources in high intensity target systems can be inexpensive andcompact enough to allow for multiple simultaneous beams from differentangles. Delivering multiple simultaneous beams facilitates combinationof the benefits from IMRT or arc therapy with the FLASH effect.

Some portions of the detailed descriptions are presented in terms ofprocedures, logic blocks, processing, and other symbolic representationsof operations on data bits within a computer memory. These descriptionsand representations are the means generally used by those skilled indata processing arts to effectively convey the substance of their workto others skilled in the art. A procedure, logic block, process, etc.,is here, and generally, conceived to be a self-consistent sequence ofsteps or instructions leading to a desired result. The steps includephysical manipulations of physical quantities. Usually, though notnecessarily, these quantities take the form of electrical, magnetic,optical, or quantum signals capable of being stored, transferred,combined, compared, and otherwise manipulated in a computer system. Ithas proven convenient at times, principally for reasons of common usage,to refer to these signals as bits, values, elements, symbols,characters, terms, numbers, or the like.

It should be borne in mind, however, that all of these and similar termsare associated with the appropriate physical quantities and are merelyconvenient labels applied to these quantities. Unless specificallystated otherwise as apparent from the following discussions, it isappreciated that throughout the present application, discussionsutilizing terms such as “processing”, “computing”, “calculating”,“determining”, “displaying” or the like, refer to the action andprocesses of a computer system, or similar processing device (e.g., anelectrical, optical or quantum computing device) that manipulates andtransforms data represented as physical (e.g., electronic) quantities.The terms refer to actions and processes of the processing devices thatmanipulate or transform physical quantities within a computer system'scomponent (e.g., registers, memories, other such information storage,transmission or display devices, etc.) into other data similarlyrepresented as physical quantities within other components.

The foregoing descriptions of specific embodiments of the presentinvention have been presented for purposes of illustration anddescription. They are not intended to be exhaustive or to limit theinvention to the precise forms disclosed, and obviously manymodifications and variations are possible in light of the aboveteaching. The embodiments were chosen and described in order to bestexplain the principles of the invention and its practical application,to thereby enable others skilled in the art to best utilize theinvention and various embodiments with various modifications as suitedto the particular use contemplated. It is intended that the scope of theinvention be defined by the Claims appended hereto and theirequivalents. The listing of steps within method claims do not imply anyparticular order to performing the steps, unless explicitly stated inthe claim.

1. An accelerator system comprising: a particle source configured togenerate charged particles; an acceleration portion configured toaccelerate the charged particles; a high intensity target configured togenerate Bremsstrahlung radiation in response to impact by theaccelerated charged particles, wherein the high intensity target is areplaceable high intensity target and is replaced in accordance withcatastrophic failure mechanism limitations rather than fatigue failuremechanism limitations; and a target location control componentconfigured to change the location of charged particle impacts on thehigh intensity target, wherein said change of location of chargedparticle impact is based on thermal diffusion and said location ofcharged particle impacts is moved at a rate greater than a rate ofdiffusion of detrimental heat impacts on the high intensity target. 2.(canceled)
 3. The accelerator system of claim 1, wherein saidBremsstrahlung radiation corresponds to average dose rates greater thanor equal to 1.0 greys per second (Gy/s) when measured at one meter fromthe radiation source.
 4. The accelerator system of claim 1, wherein apower limit on the generation of the Bremsstrahlung radiation is basedupon a melting temperature of a material which constitutes at least aportion of the high intensity target.
 5. The accelerator system of claim1, wherein the high intensity target is configured to load in and unloadfrom the accelerator system.
 6. The accelerator system of claim 1,wherein the target location control component moves the high intensitytarget to adjust a location of charged particle impacts on the highintensity target.
 7. The accelerator system of claim 1, wherein saidBremsstrahlung radiation corresponds to average dose rates greater thanor equal to 1.5 greys per second (Gy/s) at isocenter.
 8. The acceleratorsystem of claim 5, wherein said accelerator is calibrated with a sourceto axis distance (SAD) of less than or equal to 80 cm.
 9. Theaccelerator system of claim 7, wherein said Bremsstrahlung radiationcorresponds to average dose rates greater than or equal to 2.0 greys persecond (Gy/s) at isocenter.
 10. The accelerator system of claim 1,further comprising a plurality of accelerators, wherein said acceleratoris one of the plurality of accelerators.
 11. The accelerator system ofclaim 10, wherein said accelerator contributes Bremsstrahlung radiationcorresponding to average dose rates greater than or equal to 1.5 greysper second (Gy/s) at isocenter to a total dose rate of Bremsstrahlungradiation from said plurality of accelerators, wherein said total doserate of Bremsstrahlung radiation corresponds to average dose ratesgreater than or equal to 40.0 greys per second (Gy/s) at isocenter. 12.A radiation method comprising: loading a replaceable high intensitytarget in a radiation system; producing Bremsstrahlung radiation withthe replaceable high intensity target; and unloading the replaceablehigh intensity target in a radiation system, wherein the unloading isassociated with periodic replacement based upon catastrophic failuremechanisms rather than protracted fatigue failure mechanisms.
 13. Aradiation method of claim 12, wherein the periodic replacement of theremovable high intensity target corresponds to a predetermined schedule.14. A radiation method of claim 12, wherein the loading of thereplaceable high intensity target and unloading of the replaceable highintensity target are performed automatically.
 15. A radiation method ofclaim 12, wherein the replaceable high intensity target is disposed ofafter removal.
 16. A radiation method of claim 12, further comprisingproviding information regarding the replaceable high intensity target toa target monitoring system.
 17. A radiation method of claim 12, furthercomprising changing an impact location of charged particles on thereplaceable high intensity target, wherein a change in the impactlocation is in part based upon heat generation resulting from the impactof the charged particles on the replaceable high intensity target.
 18. Aradiation method of claim 12, further comprising calibrating a radiationgeneration component in accordance with a source to axis distance (SAD)of less than or equal to 80 cm.
 19. A radiation method of claim 12,further comprising coordinating the generating Bremsstrahlung radiationfrom a plurality of accelerators.
 20. A radiation method of claim 12,further comprising performing a quality check on the replaceable highintensity target.
 21. A radiation method of claim 12, wherein theproducing Bremsstrahlung radiation and loading/unloading the replaceablehigh intensity target is performed in accordance with a treatment plan.22. An accelerator system comprising: a particle source configured togenerate charged particles; an acceleration system configured toaccelerate the charged particles; a replaceable high intensity targetconfigured to generate a Bremsstrahlung radiation beam in response toimpact by the accelerated charged particles; and a loading systemconfigured to load and unload the replaceable high intensity target. 23.The accelerator system of claim 22, wherein the loading system includesone or more mechanisms for inserting and/or ejecting the replaceablehigh intensity target.
 24. The accelerator system of claim 22, whereinat least a portion of the loading and unloading of the replaceable highintensity target is performed automatically.
 25. The accelerator systemof claim 22, wherein a power limit is based upon a melting pointtemperature of a material which constitutes at least a portion of thereplaceable high intensity target.
 26. The accelerator system of claim22, wherein an occurrence of replacement of the replaceable highintensity target is based upon thermal shock.
 27. An accelerator systemof claim 22, wherein the loading system includes a target locationcontrol component and the loading system moves the replaceable highintensity target to change a respective impact position of the chargedparticles on the replaceable high intensity target.
 28. An acceleratorsystem of claim 27, wherein movement of a location of charged particleimpacts on the replaceable high intensity target is determined basedupon a thermal diffusion rate in the replaceable high intensity target.29. An accelerator system of claim 27, wherein location of chargedparticle impacts on the replaceable high intensity target is changed ata speed of greater than or equal to 0.3 meters per second.
 30. Anaccelerator system of claim 22, wherein the charged particles aredelivered to the removable high intensity target in accordance withradio frequency pluses at a rate equal to or greater than 500 pulses persecond (pps).
 31. The accelerator system of claim 22, wherein theaccelerator system includes a quality check system that checks properperformance of the replaceable high intensity target.
 32. Theaccelerator system of claim 22, wherein the accelerator system isconfigured to automatically monitor the condition of the replaceablehigh intensity target.
 33. The accelerator system of claim 22, whereinthe replaceable high intensity target includes an identificationfeature.
 34. The accelerator system of claim 33, wherein the acceleratorsystem is configured to automatically determine characteristics of thereplaceable high intensity target based on the identification feature.